Underpotential deposition of Cu on Pt(001): Interface structure and the influence of adsorbed bromide
- Oliver Lodge Laboratory, Department of Physics, University of Liverpool, Liverpool, L697ZE (United Kingdom)
- Materials Sciences Division, Lawrence Berkeley National Laboratory, University of California, Berkeley, California 94720 (United States)
Using {ital in situ} x-ray diffraction, we studied the underpotential deposition (UPD) of copper onto a Pt(001) electrode both in pure perchloric acid and in the presence of bromide anions. In pure perchloric acid, the Cu is deposited in pseudomorphic p(1{times}1) islands. In the presence of bromide anions, the strong Pt-Br interaction significantly broadens the potential range of Cu UPD. We propose that Br remains in the interface region throughout the UPD process, at first in a disordered Cu-Br phase and then, at more negative potential, forming a c(2{times}2) closed-packed monolayer on top of the completed p(1{times}1) Cu monolayer. The structures are compared to those found during Cu UPD onto Pt(111), and explained in terms of the metal-halide interactions and the Pt surface atomic geometry. {copyright} {ital 1998} {ital The American Physical Society}
- OSTI ID:
- 614988
- Journal Information:
- Physical Review, B: Condensed Matter, Vol. 57, Issue 20; Other Information: PBD: May 1998
- Country of Publication:
- United States
- Language:
- English
Similar Records
Effect of anions on the underpotential deposition of Cu on Pt(111) and Pt(100) surfaces
Copper electrodeposition on Pt(111) in the presence of chloride and (bi)sulfate: Rotating ring-Pt(111) disk electrode studies