Laser-chemical three-dimensional writing for microelectromechanics and application to standard-cell microfluidics

Conference · · Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States)

OSTI ID:6128266

Bloomstein, T M; Ehrlich, D J ^[1]

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1. Massachusetts Institute of Technology, Lexington (United States)

A high-speed technique has been developed for machining three-dimensional silicon parts using laser-induced chlorine etching reactions. Parts are created directly from solid-modeling computer-aided-design/computer-aided-manufacturing software. Removal rates exceeding 2 x 10[sup 4] and >10[sup 5][mu]m[sup 3]/s are achieved at 1 and 15 [mu]m x-y resolution, respectively. This is several orders of magnitude faster than electrodischarge machining methods. Submicrometer resolution has been achieved. Laser-induced metallization of resulting structures as well as replication through compression molding have been demonstrated. A class of microfluidic flow-channel devices is under development using a standard-cell software architecture combined with field stitching. 9 refs., 6 figs.

• OSTI ID: 6128266
• Report Number(s): CONF-920575-; CODEN: JVTBD9
• Journal Information: Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States), Vol. 10:6; Conference: Symposium on electron, ion and photon beams, Orlando, FL (United States), 26-29 May 1992; ISSN 0734-211X
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
MICROELECTRONICS
COMPUTER-AIDED DESIGN
COMPUTER-AIDED MANUFACTURING
SILICON
CHEMICAL MACHINING
LASER BEAM MACHINING
CHLORINE
ETCHING
RESOLUTION
DESIGN
ELEMENTS
HALOGENS
MACHINING
MANUFACTURING
NONMETALS
SEMIMETALS
SURFACE FINISHING
420200* - Engineering- Facilities
Equipment
& Techniques
426000 - Engineering- Components
Electron Devices & Circuits- (1990-)