Design Calculations for the Microchannel Heatsink

Conference · Tue Jan 15 00:00:00 EST 1991

OSTI ID:6105997

Riddle, R. A. ^[1]; Contolini, R. J. ^[1]; Bernhardt, A. F. ^[1]

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1. Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)

The microchannel heatsink (MCHS) has been shown to be a very compact, effective heat transfer structure. It has the capability to provide cooling for high-speed computer chips, laser diodes arrays, radio and microwave frequency amplifiers and other high power electronic devices. As an example of its capability a 1 kW/cm² heat dissipation has been obtained with a 100 °C temperature differential between the active device surface and the water coolant. In order to understand and predict the thermal performance of the MCHS using various power devices, different coolants, and structural configurations a computer program MCHSCALC has been written. This program has been verified by comparison to experimental data.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: W-7405-ENG-48
• OSTI ID: 6105997
• Report Number(s): UCRL-JC-105120; CONF-910292-1; ON: DE91008730
• Resource Relation: Conference: National Electronics Products Conference (NEPCON), Anaheim, CA (United States), Feb 1991
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
97 MATHEMATICS AND COMPUTING
ELECTRONIC EQUIPMENT
COOLING
HEAT SINKS
M CODES
COOLANTS
DESIGN
ELECTRONIC CIRCUITS
HEAT TRANSFER
TESTING
THIN FILMS
TUNGSTEN SILICIDES
WATER
COMPUTER CODES
ENERGY TRANSFER
EQUIPMENT
FILMS
HYDROGEN COMPOUNDS
OXYGEN COMPOUNDS
REFRACTORY METAL COMPOUNDS
SILICIDES
SILICON COMPOUNDS
SINKS
TRANSITION ELEMENT COMPOUNDS
TUNGSTEN COMPOUNDS
426000* - Engineering- Components
Electron Devices & Circuits- (1990-)
990200 - Mathematics & Computers