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Title: Fabrication of quartz resonators by float polishing

Conference ·
OSTI ID:6063882

AT-cut crystalline quartz blanks that are polished with conventional techniques generally fracture at much lower tensile-stress levels than the theoretical value. The fractures initiate at microcracks which are present on the surfaces and edges of these blanks, and which are caused by lapping and polishing techniques utilized in their manufacture. To obtain precision quartz frequency standards that can withstand a high-G environment a new polishing technique, float polishing, was employed. Blanks 6.35 mm in diameter and 175 ..mu..m thick were float polished - to a thickness corresponding to an operating frequency of 16 MHz - in two batches using fumed SiO/sub 2/ and colloidal SiO/sub 2/. A third batch was polished to this same frequency using TiO/sub 2/ in the float polishing apparatus. These three batches were then evaluated for surface roughness, parallelism, overall surface and edge quality, and stress-failure threshold. Initial results indicate that the batch that was float polished with colloidal SiO/sub 2/ yielded the most improvement, and on an average the stress-failure threshold for this batch improved by a factor of two as compared with conventionally processed blanks. The fractures appear to initiate primarily at imperfections on the edges of these samples.

Research Organization:
New Mexico Univ., Albuquerque (USA). Center for High Technology Materials; Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6063882
Report Number(s):
SAND-86-0528C; CONF-8604148-1; ON: DE86007616
Resource Relation:
Conference: Ideas in science and electronics conference, Albuquerque, NM, USA, 29 Apr 1986; Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English