Copper corrosion in irradiated environments: The influence of H{sub 2}O{sub 2}on the electrochemistry of copper dissolution in HCl electrolyte
The anodic dissolution of copper was examined in deaerated, 0.1 M HCl aqueous solution in the presence of H{sub 2}O{sub 2}. Concentrations of H{sub 2}O{sub 2} up to 0.2 M were studied at a rotating copper disk-platinum ring electrode. The open circuit potential (OCP) of copper was found to depend on both peroxide concentration and rotation rate. The OCP shifts towards more positive values with increasing H{sub 2}O{sub 2} concentration (C) and decreasing rotation rate. The current-voltage curves for anodic dissolution of copper were also influenced by the presence of peroxide. The curves recorded with the potential scanned in the positive direction showed the expected 60 mV slope, but the reverse scans showed significant departures. At a given potential scan rate, hysteresis was observed which was larger for higher H{sub 2}O{sub 2} concentrations, lower rotation rates, and more positive anodic potential limits. Monitoring the cuprous ions at the outer Pt ring revealed that there was a complex set of events taking place at the copper surface, including film formation and the appearance of cupric ions. 13 refs., 7 figs.
- Research Organization:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Minnesota Univ., Minneapolis, MN (United States); Belgrade Univ. (Yugoslavia). Inst. of Electrochemistry
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 60120
- Report Number(s):
- UCRL-95961; CONF-861207-116; ON: DE88000419
- Resource Relation:
- Conference: Materials Research Society (MRS) fall meeting, Boston, MA (United States), 1-5 Dec 1986; Other Information: PBD: Dec 1986
- Country of Publication:
- United States
- Language:
- English
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