Phase 2 of the array automated assembly task for the low cost silicon solar array project. Third quarterly report, April 1, 1978--June 30, 1978
Development effort has been applied to front junction and back surface field region formation and to high speed application of AR coatings to ribbon material. Effects on cell performance of various surface preparation procedures for web silicon material have also been studied. Ultrasonic seam bonding of foil interconnects to cell metallization has been identified as a potentially higher throughput, lower cost method of interconnection than producing discrete bonds. Collecting junctions have been made in wafer cells using reagent grade POCl/sub 3/, containing titanium at the 20 ppMa level, and in such material doped with Ti to the 100 and 500more »