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Title: Characterization of dc magnetron sputtering systems for the deposition of tantalum nitride, titanium, and palladium thin films for HMC (hybrid microcircuit) applications

Abstract

This report covers the initial characterization of two new dc magnetron sputtering systems which were acquired for the purpose of modernizing our capability for the deposition of tantalum nitride, titanium, and palladium thin films for HMC applications. These systems were purchased to replace two old metallization systems which had been used in this application for more than a decade. Parametric studies were carried out to characterize the systems. Operating conditions were established for the deposition of tantalum nitride films in one system and for the deposition of Ti/Pd films in the other system. These conditions were shown to produce films with properties equal to or better than were being achieved with the equipment being replaced. In addition, the new equipment was found to be simpler and easier to operate than the old systems. The data obtained during the course of this characterization study are presented. 15 refs., 44 figs., 8 tabs.

Authors:
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (USA)
OSTI Identifier:
5884585
Report Number(s):
SAND-89-0660
ON: DE89014328
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Technical Report
Resource Relation:
Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 36 MATERIALS SCIENCE; MICROELECTRONIC CIRCUITS; SPUTTERING; MICROELECTRONICS; PALLADIUM; TANTALUM NITRIDES; THIN FILMS; TITANIUM; ELECTRONIC CIRCUITS; ELEMENTS; FILMS; METALS; NITRIDES; NITROGEN COMPOUNDS; PLATINUM METALS; PNICTIDES; REFRACTORY METAL COMPOUNDS; TANTALUM COMPOUNDS; TRANSITION ELEMENT COMPOUNDS; TRANSITION ELEMENTS; 420800* - Engineering- Electronic Circuits & Devices- (-1989); 360201 - Ceramics, Cermets, & Refractories- Preparation & Fabrication; 360101 - Metals & Alloys- Preparation & Fabrication

Citation Formats

Snow, G S. Characterization of dc magnetron sputtering systems for the deposition of tantalum nitride, titanium, and palladium thin films for HMC (hybrid microcircuit) applications. United States: N. p., 1989. Web.
Snow, G S. Characterization of dc magnetron sputtering systems for the deposition of tantalum nitride, titanium, and palladium thin films for HMC (hybrid microcircuit) applications. United States.
Snow, G S. Sat . "Characterization of dc magnetron sputtering systems for the deposition of tantalum nitride, titanium, and palladium thin films for HMC (hybrid microcircuit) applications". United States.
@article{osti_5884585,
title = {Characterization of dc magnetron sputtering systems for the deposition of tantalum nitride, titanium, and palladium thin films for HMC (hybrid microcircuit) applications},
author = {Snow, G S},
abstractNote = {This report covers the initial characterization of two new dc magnetron sputtering systems which were acquired for the purpose of modernizing our capability for the deposition of tantalum nitride, titanium, and palladium thin films for HMC applications. These systems were purchased to replace two old metallization systems which had been used in this application for more than a decade. Parametric studies were carried out to characterize the systems. Operating conditions were established for the deposition of tantalum nitride films in one system and for the deposition of Ti/Pd films in the other system. These conditions were shown to produce films with properties equal to or better than were being achieved with the equipment being replaced. In addition, the new equipment was found to be simpler and easier to operate than the old systems. The data obtained during the course of this characterization study are presented. 15 refs., 44 figs., 8 tabs.},
doi = {},
url = {https://www.osti.gov/biblio/5884585}, journal = {},
number = ,
volume = ,
place = {United States},
year = {1989},
month = {7}
}

Technical Report:
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