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Title: The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging

Abstract

A uniform coolant distribution in the manifold of a liquid cooling module is necessary to eliminate local hot spots in electronic packaging. A numerical study was conducted to determine the effects of the Reynolds number and width ratio D[sub c]/D[sub d] (defined as the ratio of the combining header width to the dividing header width) on the coolant distribution in a parallel flow manifold. Of the four width ratios (0.5. 1.0, 2.0 and 4.0), the case of D[sub c]/D[sub d] = 4.0 produced the best coolant distribution; the ratio of the maximum channel flow rate to the minimum channel flow rate was 1.2. Regardless of the width ratio, the flow distribution is strongly dependent on the Reynolds number. It is concluded that a proper combination of the Reynolds number, D[sub c]/D[sub d], and the area ratio, AR, is required to produce a uniform flow distribution in a manifold.

Authors:
; ;  [1]
  1. Drexel Univ., Philadelphia, PA (United States). Dept. of Mechanical Engineering
OSTI Identifier:
5869727
Resource Type:
Journal Article
Journal Name:
International Communications in Heat and Mass Transfer; (United States)
Additional Journal Information:
Journal Volume: 20:5; Journal ID: ISSN 0735-1933
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; DUCTS; FLUID FLOW; FLOW RATE; HEAT TRANSFER FLUIDS; REYNOLDS NUMBER; FLUIDS; 420400* - Engineering- Heat Transfer & Fluid Flow

Citation Formats

Choi, S H, Shin, Sehyen, and Cho, Y I. The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging. United States: N. p., Web. doi:10.1016/0735-1933(93)90073-5.
Choi, S H, Shin, Sehyen, & Cho, Y I. The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging. United States. https://doi.org/10.1016/0735-1933(93)90073-5
Choi, S H, Shin, Sehyen, and Cho, Y I. . "The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging". United States. https://doi.org/10.1016/0735-1933(93)90073-5.
@article{osti_5869727,
title = {The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging},
author = {Choi, S H and Shin, Sehyen and Cho, Y I},
abstractNote = {A uniform coolant distribution in the manifold of a liquid cooling module is necessary to eliminate local hot spots in electronic packaging. A numerical study was conducted to determine the effects of the Reynolds number and width ratio D[sub c]/D[sub d] (defined as the ratio of the combining header width to the dividing header width) on the coolant distribution in a parallel flow manifold. Of the four width ratios (0.5. 1.0, 2.0 and 4.0), the case of D[sub c]/D[sub d] = 4.0 produced the best coolant distribution; the ratio of the maximum channel flow rate to the minimum channel flow rate was 1.2. Regardless of the width ratio, the flow distribution is strongly dependent on the Reynolds number. It is concluded that a proper combination of the Reynolds number, D[sub c]/D[sub d], and the area ratio, AR, is required to produce a uniform flow distribution in a manifold.},
doi = {10.1016/0735-1933(93)90073-5},
url = {https://www.osti.gov/biblio/5869727}, journal = {International Communications in Heat and Mass Transfer; (United States)},
issn = {0735-1933},
number = ,
volume = 20:5,
place = {United States},
year = {},
month = {}
}