The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging
Abstract
A uniform coolant distribution in the manifold of a liquid cooling module is necessary to eliminate local hot spots in electronic packaging. A numerical study was conducted to determine the effects of the Reynolds number and width ratio D[sub c]/D[sub d] (defined as the ratio of the combining header width to the dividing header width) on the coolant distribution in a parallel flow manifold. Of the four width ratios (0.5. 1.0, 2.0 and 4.0), the case of D[sub c]/D[sub d] = 4.0 produced the best coolant distribution; the ratio of the maximum channel flow rate to the minimum channel flow rate was 1.2. Regardless of the width ratio, the flow distribution is strongly dependent on the Reynolds number. It is concluded that a proper combination of the Reynolds number, D[sub c]/D[sub d], and the area ratio, AR, is required to produce a uniform flow distribution in a manifold.
 Authors:

 Drexel Univ., Philadelphia, PA (United States). Dept. of Mechanical Engineering
 OSTI Identifier:
 5869727
 Resource Type:
 Journal Article
 Journal Name:
 International Communications in Heat and Mass Transfer; (United States)
 Additional Journal Information:
 Journal Volume: 20:5; Journal ID: ISSN 07351933
 Country of Publication:
 United States
 Language:
 English
 Subject:
 42 ENGINEERING; DUCTS; FLUID FLOW; FLOW RATE; HEAT TRANSFER FLUIDS; REYNOLDS NUMBER; FLUIDS; 420400*  Engineering Heat Transfer & Fluid Flow
Citation Formats
Choi, S H, Shin, Sehyen, and Cho, Y I. The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging. United States: N. p.,
Web. doi:10.1016/07351933(93)900735.
Choi, S H, Shin, Sehyen, & Cho, Y I. The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging. United States. https://doi.org/10.1016/07351933(93)900735
Choi, S H, Shin, Sehyen, and Cho, Y I. .
"The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging". United States. https://doi.org/10.1016/07351933(93)900735.
@article{osti_5869727,
title = {The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging},
author = {Choi, S H and Shin, Sehyen and Cho, Y I},
abstractNote = {A uniform coolant distribution in the manifold of a liquid cooling module is necessary to eliminate local hot spots in electronic packaging. A numerical study was conducted to determine the effects of the Reynolds number and width ratio D[sub c]/D[sub d] (defined as the ratio of the combining header width to the dividing header width) on the coolant distribution in a parallel flow manifold. Of the four width ratios (0.5. 1.0, 2.0 and 4.0), the case of D[sub c]/D[sub d] = 4.0 produced the best coolant distribution; the ratio of the maximum channel flow rate to the minimum channel flow rate was 1.2. Regardless of the width ratio, the flow distribution is strongly dependent on the Reynolds number. It is concluded that a proper combination of the Reynolds number, D[sub c]/D[sub d], and the area ratio, AR, is required to produce a uniform flow distribution in a manifold.},
doi = {10.1016/07351933(93)900735},
url = {https://www.osti.gov/biblio/5869727},
journal = {International Communications in Heat and Mass Transfer; (United States)},
issn = {07351933},
number = ,
volume = 20:5,
place = {United States},
year = {},
month = {}
}