Field-assisted bonding of single crystal quartz
A technique to produce strong, hermetic bonds between plates of single crystal quartz using a modified field-assisted bonding process is presented. Field-assisted bonding is a technique traditionally used to join glass to metals at temperatures well below normal glass softening temperatures. To promote reactivity between quartz within an electrical field at temperatures well below quartz transformation temperatures, thin films of silicon metal and glass were vapor deposited onto adjacent quartz plates. Thermal stresses caused by expansion mismatch between the quartz and the films were of concern. These stresses were reduced by determining the minimum film thicknesses capable of yielding sufficient reactivity for bonding. Processing studies were conducted to optimize bond integrity, and bonds were characterized by hermeticity, thermal shock, and mechanical shock. Packages produced under the most ideal conditions were able to survive greater than 1000 psi shock loads. 11 refs., 10 figs., 3 tabs.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (USA)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 5828069
- Report Number(s):
- SAND-89-0814C; CONF-8908132-1; ON: DE89015407
- Resource Relation:
- Conference: 11. quartz devices conference, Kansas City, MO, USA, 28-31 Aug 1989; Other Information: Portions of this document are illegible in microfiche products
- Country of Publication:
- United States
- Language:
- English
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Method of bonding single crystal quartz by field-assisted bonding
Method of bonding single crystal quartz by field-assisted bonding
Related Subjects
METALS
BONDING
QUARTZ
CRYSTALS
ELECTRIC FIELDS
GLASS
IMPACT SHOCK
SHEAR
SILICON
THERMAL SHOCK
THICKNESS
THIN FILMS
CHALCOGENIDES
DIMENSIONS
ELEMENTS
FABRICATION
FILMS
JOINING
MINERALS
OXIDE MINERALS
OXIDES
OXYGEN COMPOUNDS
SEMIMETALS
SILICON COMPOUNDS
SILICON OXIDES
360601* - Other Materials- Preparation & Manufacture