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Title: Method of making a semiconductor light-emitting device utilizing low-temperature vapor-phase deposition

Patent ·
OSTI ID:5806756

In order to decrease threshold current of a semiconductor laser, and to obtain a single mode lasing suitable for use in light communication, the semiconductor laser is formed in stripe type in which the light-emitting (i.e., active) layer and neighboring layers are formed in mesa-etched stripe type and low impurity concentration (i.e., high resistivity) layers of GaAs, GaAsP or GaAlAs are situated to contact the mesa-etched side faces of the stripe-shaped part on the semiconductor device by vapor phase growth, vacuum deposition, sputtering, or molecular beam deposition. Since the wafer temperature can be kept fairly low (e.g., 400 to 700/sup 0/C) in comparison with that (about 950/sup 0/C) in a liquid phase growth, the stress introduced during the deposition is smaller than that in a liquid phase growth.

Assignee:
Matsushita Electric Industrial Co Ltd (Japan)
Patent Number(s):
US 4188244
OSTI ID:
5806756
Resource Relation:
Patent Priority Date: Priority date 10 Apr 1975, Japan; Other Information: PAT-APPL-947419
Country of Publication:
United States
Language:
English