Effect of strain and strain rate on residual microstructures in copper
Several specimens of OFE Cu were deformed in compression to study the resulting microstructures at equivalent levels of threshold stress and strain. Equiaxed, diffuse dislocation cells are more persistent in Cu when tested at strain rates exceeding 10/sup 3/ sec/sup -1/. At quasi-static strain rates, dislocation collapse into more distinct, narrow microbands occurs at lower strain levels.
- Research Organization:
- Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
- DOE Contract Number:
- W-7405-ENG-36
- OSTI ID:
- 5729463
- Report Number(s):
- LA-UR-86-797; CONF-860829-2; ON: DE86007361
- Resource Relation:
- Journal Volume: 44; Conference: Annual joint meeting of the Electron Microscopy Society of America and the Microbeam Analysis Society, Albuquerque, NM, USA, 10 Aug 1986
- Country of Publication:
- United States
- Language:
- English
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