Fundamental processes in ion plating
Ion plating is a generic term applied to film deposition processes in which the substrate surface and/or the depositing film is subjected to a flux of high energy particles sufficient to cause changes in the interfacial region of film properties compared to a nonbombarded deposition. Ion plating is being accepted as an alternative coating technique to sputter deposition, vacuum evaporation and electroplating. In order to intelligently choose between the various deposition techniques, the fundamental mechanisms, relating to ion plating, must be understood. This paper reviews the effects of low energy ion bombardment on surfaces, interface formation and film development as they apply to ion plating and the implementation and applications of the ion plating process.
- Research Organization:
- Sandia Labs., Albuquerque, NM (USA)
- DOE Contract Number:
- EY-76-C-04-0789
- OSTI ID:
- 5726274
- Report Number(s):
- SAND-79-1774C; CONF-800205-2; TRN: 80-004796
- Resource Relation:
- Conference: American Institute of Metallurgical Engineers meeting, Las Vegas, NV, USA, Feb 1980
- Country of Publication:
- United States
- Language:
- English
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