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Title: Fundamental processes in ion plating

Abstract

Ion plating is a generic term applied to film deposition processes in which the substrate surface and/or the depositing film is subjected to a flux of high energy particles sufficient to cause changes in the interfacial region of film properties compared to a nonbombarded deposition. Ion plating is being accepted as an alternative coating technique to sputter deposition, vacuum evaporation and electroplating. In order to intelligently choose between the various deposition techniques, the fundamental mechanisms, relating to ion plating, must be understood. This paper reviews the effects of low energy ion bombardment on surfaces, interface formation and film development as they apply to ion plating and the implementation and applications of the ion plating process.

Authors:
Publication Date:
Research Org.:
Sandia Labs., Albuquerque, NM (USA)
OSTI Identifier:
5726274
Report Number(s):
SAND-79-1774C; CONF-800205-2
TRN: 80-004796
DOE Contract Number:  
EY-76-C-04-0789
Resource Type:
Conference
Resource Relation:
Conference: American Institute of Metallurgical Engineers meeting, Las Vegas, NV, USA, Feb 1980
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; VAPOR PLATING; ION COLLISIONS; PHYSICAL RADIATION EFFECTS; EV RANGE; SPUTTERING; COLLISIONS; DEPOSITION; ENERGY RANGE; PLATING; RADIATION EFFECTS; SURFACE COATING; 640301* - Atomic, Molecular & Chemical Physics- Beams & their Reactions

Citation Formats

Mattox, D.M. Fundamental processes in ion plating. United States: N. p., 1980. Web.
Mattox, D.M. Fundamental processes in ion plating. United States.
Mattox, D.M. Tue . "Fundamental processes in ion plating". United States. https://www.osti.gov/servlets/purl/5726274.
@article{osti_5726274,
title = {Fundamental processes in ion plating},
author = {Mattox, D.M.},
abstractNote = {Ion plating is a generic term applied to film deposition processes in which the substrate surface and/or the depositing film is subjected to a flux of high energy particles sufficient to cause changes in the interfacial region of film properties compared to a nonbombarded deposition. Ion plating is being accepted as an alternative coating technique to sputter deposition, vacuum evaporation and electroplating. In order to intelligently choose between the various deposition techniques, the fundamental mechanisms, relating to ion plating, must be understood. This paper reviews the effects of low energy ion bombardment on surfaces, interface formation and film development as they apply to ion plating and the implementation and applications of the ion plating process.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1980},
month = {1}
}

Conference:
Other availability
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