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Title: Structure and physical properties of polycrystalline hexagonal Ta sub 2 N films deposited by reactive sputtering

Journal Article · · Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (USA)
DOI:https://doi.org/10.1116/1.577247· OSTI ID:5690862
; ;  [1];  [2]
  1. Department of Materials Science, the Coordinated Science Laboratory, and the Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801 (USA)
  2. Extel Corporation, Northbrook, Illinois 60062 (USA)

Hexagonal-structure polycrystalline Ta{sub 2}N films with (21{bar 3}1) preferred orientation were deposited by reactive sputter deposition onto glass substrates in mixed Ar/N{sub 2} atmospheres. Transmission electron microscopy examination of Ta{sub 2}N films grown on BaF{sub 2}(111) using the same deposition conditions showed that the average grain size was {congruent}10 nm. The room-temperature resistivity and temperature coefficient of resistivity of films grown on glass were 2{times}10{sup {minus}4} {Omega} cm and 1.2{times}10{sup {minus}4} K{sup {minus}1}, respectively. The films exhibited relatively low compressive stresses, 1--3{times}10{sup 9} dyn cm{sup {minus}2}, and film/substrate couples photolithographically patterned into thin-film heater elements withstood 2{times}10{sup 7} thermal cycles between {lt}200 and {congruent}850 {degree}C.

OSTI ID:
5690862
Journal Information:
Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (USA), Vol. 9:4; ISSN 0734-2101
Country of Publication:
United States
Language:
English