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Title: Electronics cooling of Phenix multiplicity and vertex detector

Abstract

The Multiplicity and Vertex Detector (MVD) uses silicon strip sensors arranged in two concentric barrels around the beam pipe of the PHENIX detector that will be installed at Brookhaven National Laboratory. Each silicon sensor is connected by a flexible kapton cable to its own front-end electronics printed circuit board that is a multi-chip module or MCM. The MCMs are the main heat source in the system. To maintain the MVD at optimized operational status, the maximum temperature of the multi-chip modules must be below 40 C. Using COSMOS/M HSTAR for the Heat Transfer analysis, a finite element model of a typical MCM plate was created to simulate a 9m/s airflow and 9m/s mixed flow composed of 50% helium and 50% air respectively, with convective heat transfer on both sides of the plate. The results using a mixed flow of helium and air show that the average maximum temperature reached by the MCMs is 37.5 C. The maximum temperature which is represented by the hot spots on the MCM is 39.43 C for the helium and air mixture which meets the design temperature requirement 40 C. To maintain the Multiplicity and Vertex Detector at optimized operational status, the configuration of themore » plenum chamber, the power dissipated by the silicon chips, the fluid flow velocity and comparison on the MCM design parameters will be discussed.« less

Authors:
;
Publication Date:
Research Org.:
Los Alamos National Lab., NM (United States)
Sponsoring Org.:
USDOE Assistant Secretary for Human Resources and Administration, Washington, DC (United States)
OSTI Identifier:
563286
Report Number(s):
LA-UR-97-3195; CONF-971187-
ON: DE98001343; TRN: 98:002646
DOE Contract Number:  
W-7405-ENG-36
Resource Type:
Technical Report
Resource Relation:
Conference: 2. biennial Tri-Laboratory engineering conference on modeling and simulation, Santa Fe, NM (United States), 12-14 Nov 1997; Other Information: PBD: Aug 1996
Country of Publication:
United States
Language:
English
Subject:
44 INSTRUMENTATION, INCLUDING NUCLEAR AND PARTICLE DETECTORS; 43 PARTICLE ACCELERATORS; BROOKHAVEN RHIC; ELECTRONIC CIRCUITS; SI SEMICONDUCTOR DETECTORS; COOLING SYSTEMS; TEMPERATURE CONTROL; HEAT TRANSFER; GAS COOLING; THEORETICAL DATA; COMPUTERIZED SIMULATION

Citation Formats

Chen, Z, and Gregory, W S. Electronics cooling of Phenix multiplicity and vertex detector. United States: N. p., 1996. Web. doi:10.2172/563286.
Chen, Z, & Gregory, W S. Electronics cooling of Phenix multiplicity and vertex detector. United States. doi:10.2172/563286.
Chen, Z, and Gregory, W S. Thu . "Electronics cooling of Phenix multiplicity and vertex detector". United States. doi:10.2172/563286. https://www.osti.gov/servlets/purl/563286.
@article{osti_563286,
title = {Electronics cooling of Phenix multiplicity and vertex detector},
author = {Chen, Z and Gregory, W S},
abstractNote = {The Multiplicity and Vertex Detector (MVD) uses silicon strip sensors arranged in two concentric barrels around the beam pipe of the PHENIX detector that will be installed at Brookhaven National Laboratory. Each silicon sensor is connected by a flexible kapton cable to its own front-end electronics printed circuit board that is a multi-chip module or MCM. The MCMs are the main heat source in the system. To maintain the MVD at optimized operational status, the maximum temperature of the multi-chip modules must be below 40 C. Using COSMOS/M HSTAR for the Heat Transfer analysis, a finite element model of a typical MCM plate was created to simulate a 9m/s airflow and 9m/s mixed flow composed of 50% helium and 50% air respectively, with convective heat transfer on both sides of the plate. The results using a mixed flow of helium and air show that the average maximum temperature reached by the MCMs is 37.5 C. The maximum temperature which is represented by the hot spots on the MCM is 39.43 C for the helium and air mixture which meets the design temperature requirement 40 C. To maintain the Multiplicity and Vertex Detector at optimized operational status, the configuration of the plenum chamber, the power dissipated by the silicon chips, the fluid flow velocity and comparison on the MCM design parameters will be discussed.},
doi = {10.2172/563286},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1996},
month = {8}
}