A fast laser alloying process for the selective electroplating of metal on SiO sub 2 and polyimide
A new laser direct-write process for patterning of metal on multichip modules has been developed. The process involves the laser modification of the non-conductive surface of a seed multilayer, converting it to a conductive surface, which can be electroplated with metal. The seed multilayer is composed of a TiW adhesion layer, onto which a Au film is sputtered, followed by an a-Si layer, which forms the non-conductive surface. The laser modifies the surface by alloying (or mixing) the Si and Au to form the conductive surface. This laser process has been shown to be capable of writing speeds of 2.5 m/s. With a silicon dioxide interlevel dielectric layer, the process works over a large range of laser power (P{sub max}/P{sub min} {approximately} 5). A polyimide interlevel dielectric layer can be used without damage or loss of adhesion, although the process margin is substantially reduced (P{sub max}/P{sub min} {approximately} 2).
- Research Organization:
- Lawrence Livermore National Lab., CA (United States)
- Sponsoring Organization:
- USDOE; USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 5580105
- Report Number(s):
- UCRL-JC-109268; CONF-911202-76; ON: DE92011764
- Resource Relation:
- Conference: Annual fall meeting of the Materials Research Society, Boston, MA (United States), 2-6 Dec 1991
- Country of Publication:
- United States
- Language:
- English
Similar Records
Laser surface modification for selective electroplating of metal: A 2. 5 m/s laser direct-write process
Laser tabbed die: A repairable, high-speed die-interconnection technology. 1994 LDRD final report 93-SR-089
Related Subjects
INTEGRATED CIRCUITS
LASER BEAM MACHINING
TITANIUM ALLOYS
TUNGSTEN BASE ALLOYS
ELECTROPLATING
LASER RADIATION
SILICON OXIDES
ALLOYS
CHALCOGENIDES
DEPOSITION
ELECTRODEPOSITION
ELECTROLYSIS
ELECTROMAGNETIC RADIATION
ELECTRONIC CIRCUITS
LYSIS
MACHINING
MICROELECTRONIC CIRCUITS
OXIDES
OXYGEN COMPOUNDS
PLATING
RADIATIONS
SILICON COMPOUNDS
SURFACE COATING
TUNGSTEN ALLOYS
360101* - Metals & Alloys- Preparation & Fabrication
360601 - Other Materials- Preparation & Manufacture