Dynamic and static fatigue behavior of sintered silicon nitrides

Conference · Sat Aug 01 00:00:00 EDT 1987 · Ceram. Eng. Sci. Proc.; (United States)

OSTI ID:5574085

Chang, J; Khandelwal, P; Heitman, P W

The dynamic and static fatigue behavior of Kyocera SN220M sintered silicon nitride at 1000 C was studied. Fractographic analysis of the material failing in dynamic fatigue revealed the presence of slow crack growth (SCG) at stressing rates below 41 MPa/min. Under conditions of static fatigue this material also displayed SCG at stresses below 345 MPa. SCG appears to be controlled by microcracking of the grain boundaries. The crack velocity exponent (n) determined from both dynamic and static fatigue tests ranged from 11 to 16. 10 references.

• OSTI ID: 5574085
• Report Number(s): CONF-870172-
• Journal Information: Ceram. Eng. Sci. Proc.; (United States), Vol. 8; Conference: 11. annual conference on composites and advanced ceramic materials, Cocoa Beach, FL, USA, 18 Jan 1987
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
SILICON NITRIDES
FATIGUE
CRACK PROPAGATION
FAILURES
FRACTOGRAPHY
GRAIN BOUNDARIES
SINTERING
CRYSTAL STRUCTURE
FABRICATION
MECHANICAL PROPERTIES
MICROSTRUCTURE
NITRIDES
NITROGEN COMPOUNDS
PNICTIDES
SILICON COMPOUNDS
360203* - Ceramics
Cermets
& Refractories- Mechanical Properties