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Title: Automated Array Assembly, Phase 2. Final technical progress report, 1979

Technical Report ·
DOI:https://doi.org/10.2172/5556863· OSTI ID:5556863

The 1979 phase of this Automated Array Assembly, Phase 2 contract was devoted solely to the tasks of scaling up the Tandem Junction Cell (TJC) from 2 cm x 2 cm to 6.2 cm x 6.2 cm and the assembly of several modules using these large-area TJCs. The scale-up of the TJC was based on using the existing process and doing the necessary design activities to increase the cell area to an acceptably large area. The design was carried out using available device models. The design was verified and sample large-area TJCs were fabricated. Mechanical and process problems occurred causing a schedule slippage that resulted in contract expiration before enough large-area TCs were fabricated to populate the sample Tandem Junction Modules (TJMs). A TJM design was carried out in which the module interconnects served to augment the current collecting buses on the cell. The module was made up of a 5 x 6 TJC matrix mounted on a porcelainized steel substrate with a glass cover. The TJC matrix was series-parallel connected using copper clad Invar interconnects soldered to the TJC metallization. Sample cell matrices were assembled using dummy cells. No sample TJMs were assembled due to a shortage of large-area TJCs and contract expiration.

Research Organization:
Texas Instruments, Inc., Dallas, TX (United States)
DOE Contract Number:
NAS-7-100-954881
OSTI ID:
5556863
Report Number(s):
DOE/JPL/954881-79-8
Country of Publication:
United States
Language:
English