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Title: Damage and contamination-free GaAs and AlGaAs etching using a novel ultrahigh-vacuum reactive ion beam etching system with etched surface monitoring and cleaning method

Journal Article · · J. Vac. Sci. Technol., A; (United States)
DOI:https://doi.org/10.1116/1.573831· OSTI ID:5540355

In situ monitoring and suppression of damage and contamination induced by GaAs and AlGaAs reactive-ion-beam-etching (RIBE) have been investigated to establish clean surfaces, required for fabricating III--V compound optoelectronic integrated circuits (OEIC's). A novel ultrahigh-vacuum RIBE system with etched surface monitors and a surface cleaning gun has been developed for this purpose. Damage suppression with low energy (10--100 eV) RIBE was confirmed with an ideality factor in a Schottky diode. Removal of Cl contamination induced by Cl/sub 2/ plasma was established with temperature-controlled (200/sup 0/C) RIBE or heat treatment (400/sup 0/C) after RIBE. Furthermore, it was demonstrated for the first time that both GaAs and AlGaAs native oxide layers could be successfully removed simply with irradiations of H and Cl radical beam released from the novel, compact electron-cyclotron-resonance (ECR) plasma gun.

Research Organization:
Optoelectronics Joint Research Laboratory, 1333 Kamikodanaka, Nakaharaku, Kawasaki 211, Japan
OSTI ID:
5540355
Journal Information:
J. Vac. Sci. Technol., A; (United States), Vol. 4:3
Country of Publication:
United States
Language:
English

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