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Title: MACWAFER. Therml & Gravitational Stress in Si Wafers; Lim. on Process Htg & Cool. Rates

Abstract

The MacWafer code determines maximum allowable processing temperatures and maximum heating and cooling rates for thermal processing of silicon semiconductor wafers in single and multiple wafer furnaces. The program runs interactively on Macintosh, PC, and workstation computers. Execution time is typically 20 seconds on a Macintosh 68040 processor operating at 33 MHz. Gravitational stresses and displacements are first calculated based on the user`s input of a support system consisting of a ring beneath the wafer and/or arbitrarily placed point supports. The maximum operating temperature is then deduced by comparing the calculated gravitational stresses with the temperature-dependent wafer strength. At lower temperatures, the difference between wafer strength and gravitational stress is used to determine the allowable thermal stress, and hence the allowable radial temperature difference across the wafer. Finally, an analytical model of radial heat transfer in a batch furnace yields the maximum heating or cooling rate as a function of the allowable temperature difference based on the user`s inputs of wafer spacing and furnace power. Outputs to the screen include plots of stress components and vertical displacement, as well as tables of maximum stresses and maximum heating and cooling rates as a function of temperature. All inputs and outputs maymore » be directed to user-named files for further processing or graphical display.« less

Authors:
;  [1]
  1. Sandia National Labs., Livermore, CA (United States)
Publication Date:
Research Org.:
Sandia National Labs., Livermore, CA (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
553776
Report Number(s):
ESTSC-001183MLTPL00
Resource Type:
Technical Report
Resource Relation:
Other Information: DN: Suggested memory allocation is 4 MB; PBD: 13 Jan 1997
Country of Publication:
United States
Language:
English
Subject:
99 MATHEMATICS, COMPUTERS, INFORMATION SCIENCE, MANAGEMENT, LAW, MISCELLANEOUS; M CODES; STRESS ANALYSIS; COMPUTER PROGRAM DOCUMENTATION; HEAT TRANSFER; TRANSIENTS; DEFORMATION; ELECTRONIC EQUIPMENT; PROCESS CONTROL; COMPUTER-AIDED MANUFACTURING

Citation Formats

Griffiths, S K, and Nilson, R H. MACWAFER. Therml & Gravitational Stress in Si Wafers; Lim. on Process Htg & Cool. Rates. United States: N. p., 1997. Web.
Griffiths, S K, & Nilson, R H. MACWAFER. Therml & Gravitational Stress in Si Wafers; Lim. on Process Htg & Cool. Rates. United States.
Griffiths, S K, and Nilson, R H. Mon . "MACWAFER. Therml & Gravitational Stress in Si Wafers; Lim. on Process Htg & Cool. Rates". United States.
@article{osti_553776,
title = {MACWAFER. Therml & Gravitational Stress in Si Wafers; Lim. on Process Htg & Cool. Rates},
author = {Griffiths, S K and Nilson, R H},
abstractNote = {The MacWafer code determines maximum allowable processing temperatures and maximum heating and cooling rates for thermal processing of silicon semiconductor wafers in single and multiple wafer furnaces. The program runs interactively on Macintosh, PC, and workstation computers. Execution time is typically 20 seconds on a Macintosh 68040 processor operating at 33 MHz. Gravitational stresses and displacements are first calculated based on the user`s input of a support system consisting of a ring beneath the wafer and/or arbitrarily placed point supports. The maximum operating temperature is then deduced by comparing the calculated gravitational stresses with the temperature-dependent wafer strength. At lower temperatures, the difference between wafer strength and gravitational stress is used to determine the allowable thermal stress, and hence the allowable radial temperature difference across the wafer. Finally, an analytical model of radial heat transfer in a batch furnace yields the maximum heating or cooling rate as a function of the allowable temperature difference based on the user`s inputs of wafer spacing and furnace power. Outputs to the screen include plots of stress components and vertical displacement, as well as tables of maximum stresses and maximum heating and cooling rates as a function of temperature. All inputs and outputs may be directed to user-named files for further processing or graphical display.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1997},
month = {1}
}

Technical Report:
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