Process of brazing using low temperature braze alloy of gold-indium tin
Patent
·
OSTI ID:5530811
A heat resistant brazing alloy of a major amount of gold, a lesser amount of indium and a minor amount of tin. The alloy is particularly suited for use in bonding electrical components to chip carrying substrates which are to be reworked.
- Assignee:
- International Business Machines Corporation
- Patent Number(s):
- US 4492842
- OSTI ID:
- 5530811
- Resource Relation:
- Patent File Date: Filed date 8 Aug 1983; Other Information: PAT-APPL-521286
- Country of Publication:
- United States
- Language:
- English
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OSTI ID:5530811
+7 more
Related Subjects
36 MATERIALS SCIENCE
BRAZING ALLOYS
CHEMICAL COMPOSITION
THERMAL CONDUCTIVITY
GOLD BASE ALLOYS
BRAZING
HEAT RESISTING ALLOYS
INDIUM ALLOYS
SEMICONDUCTOR MATERIALS
TIN ALLOYS
CHEMICAL BONDS
SEMICONDUCTOR DEVICES
SUBSTRATES
ALLOYS
FABRICATION
GOLD ALLOYS
HEAT RESISTANT MATERIALS
JOINING
MATERIALS
PHYSICAL PROPERTIES
THERMODYNAMIC PROPERTIES
WELDING
360101* - Metals & Alloys- Preparation & Fabrication
360104 - Metals & Alloys- Physical Properties
BRAZING ALLOYS
CHEMICAL COMPOSITION
THERMAL CONDUCTIVITY
GOLD BASE ALLOYS
BRAZING
HEAT RESISTING ALLOYS
INDIUM ALLOYS
SEMICONDUCTOR MATERIALS
TIN ALLOYS
CHEMICAL BONDS
SEMICONDUCTOR DEVICES
SUBSTRATES
ALLOYS
FABRICATION
GOLD ALLOYS
HEAT RESISTANT MATERIALS
JOINING
MATERIALS
PHYSICAL PROPERTIES
THERMODYNAMIC PROPERTIES
WELDING
360101* - Metals & Alloys- Preparation & Fabrication
360104 - Metals & Alloys- Physical Properties