Environmental embrittlement and grain-boundary fracture in Ni sub 3 Si
Abstract
Recent studies have demonstrated that many ordered intermetallic alloys exhibit environmental embrittlement when tested in air at ambient temperatures. The embrittlement involves the reaction of reactive elements in ordered intermetallics (such as Al and Si) with moisture in air, resulting in the generation of atomic hydrogen that diffuses into the alloys and causes brittle crack propagation and low ductility. In the case of Bcc-based ordered intermetallic alloys, such as iron aluminides (FeAl and Fe{sub 3}Al) the moisture-induced hydrogen causes brittle cleavage fracture and ductility reduction from 18% to 2 {approximately} 4% at room temperature. In the case of fcc-based ordered intermetallics, the embrittlement occurs mainly along grain boundaries and causes brittle intergranular fracture and reduced ductility of Co{sub 3}Ti, Ni{sub 3}(Al,Mn), (Co,Fe){sub 3}(Si,Ti) alloys. In this paper, the study of environmental effects is extended to include the binary nickel silicide, Ni{sub 3}Si(22.5 at. % Si).
- Authors:
-
- Oak Ridge National Lab., TN (United States). Metals and Ceramics Div.
- Publication Date:
- OSTI Identifier:
- 5429457
- DOE Contract Number:
- AC05-84OR21400
- Resource Type:
- Journal Article
- Journal Name:
- Scripta Metallurgica; (United States)
- Additional Journal Information:
- Journal Volume: 25:8; Journal ID: ISSN 0036-9748
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 08 HYDROGEN; NICKEL BASE ALLOYS; CRACK PROPAGATION; GRAIN BOUNDARIES; HYDROGEN EMBRITTLEMENT; INTERGRANULAR CORROSION; SILICON ALLOYS; ALUMINIUM BASE ALLOYS; AMBIENT TEMPERATURE; BINARY ALLOY SYSTEMS; CASTING; DUCTILITY; ENVIRONMENTAL EFFECTS; FABRICATION; HOT PRESSING; INTERMETALLIC COMPOUNDS; IRON BASE ALLOYS; MELTING; PHASE TRANSFORMATIONS; ALLOY SYSTEMS; ALLOYS; ALUMINIUM ALLOYS; CHEMICAL REACTIONS; CORROSION; CRYSTAL STRUCTURE; EMBRITTLEMENT; IRON ALLOYS; MATERIALS WORKING; MECHANICAL PROPERTIES; MICROSTRUCTURE; NICKEL ALLOYS; PRESSING; TENSILE PROPERTIES; 360103* - Metals & Alloys- Mechanical Properties; 360102 - Metals & Alloys- Structure & Phase Studies; 360105 - Metals & Alloys- Corrosion & Erosion; 080800 - Hydrogen- Properties & Composition
Citation Formats
Liu, C T, and Oliver, W C. Environmental embrittlement and grain-boundary fracture in Ni sub 3 Si. United States: N. p., 1991.
Web.
Liu, C T, & Oliver, W C. Environmental embrittlement and grain-boundary fracture in Ni sub 3 Si. United States.
Liu, C T, and Oliver, W C. 1991.
"Environmental embrittlement and grain-boundary fracture in Ni sub 3 Si". United States.
@article{osti_5429457,
title = {Environmental embrittlement and grain-boundary fracture in Ni sub 3 Si},
author = {Liu, C T and Oliver, W C},
abstractNote = {Recent studies have demonstrated that many ordered intermetallic alloys exhibit environmental embrittlement when tested in air at ambient temperatures. The embrittlement involves the reaction of reactive elements in ordered intermetallics (such as Al and Si) with moisture in air, resulting in the generation of atomic hydrogen that diffuses into the alloys and causes brittle crack propagation and low ductility. In the case of Bcc-based ordered intermetallic alloys, such as iron aluminides (FeAl and Fe{sub 3}Al) the moisture-induced hydrogen causes brittle cleavage fracture and ductility reduction from 18% to 2 {approximately} 4% at room temperature. In the case of fcc-based ordered intermetallics, the embrittlement occurs mainly along grain boundaries and causes brittle intergranular fracture and reduced ductility of Co{sub 3}Ti, Ni{sub 3}(Al,Mn), (Co,Fe){sub 3}(Si,Ti) alloys. In this paper, the study of environmental effects is extended to include the binary nickel silicide, Ni{sub 3}Si(22.5 at. % Si).},
doi = {},
url = {https://www.osti.gov/biblio/5429457},
journal = {Scripta Metallurgica; (United States)},
issn = {0036-9748},
number = ,
volume = 25:8,
place = {United States},
year = {Thu Aug 01 00:00:00 EDT 1991},
month = {Thu Aug 01 00:00:00 EDT 1991}
}