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Title: High performance microsystem packaging: A perspective

Abstract

The second silicon revolution will be based on intelligent, integrated microsystems where multiple technologies (such as analog, digital, memory, sensor, micro-electro-mechanical, and communication devices) are integrated onto a single chip or within a multichip module. A necessary element for such systems is cost-effective, high-performance packaging. This paper examines many of the issues associated with the packaging of integrated microsystems, with an emphasis on the areas of packaging design, manufacturability, and reliability.

Authors:
; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
542031
Report Number(s):
SAND-97-2010C; CONF-971092-
ON: DE98000179; TRN: 97:005616
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: ESREF `97: 8th European symposium on reliability of electron devices, Bordeaux (France), 7-10 Oct 1997; Other Information: PBD: 1997
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; MICROELECTRONIC CIRCUITS; PACKAGING; MANUFACTURING; RELIABILITY; MINIATURIZATION; TECHNOLOGY ASSESSMENT

Citation Formats

Romig, Jr, A D, Dressendorfer, P V, and Palmer, D W. High performance microsystem packaging: A perspective. United States: N. p., 1997. Web.
Romig, Jr, A D, Dressendorfer, P V, & Palmer, D W. High performance microsystem packaging: A perspective. United States.
Romig, Jr, A D, Dressendorfer, P V, and Palmer, D W. 1997. "High performance microsystem packaging: A perspective". United States. https://www.osti.gov/servlets/purl/542031.
@article{osti_542031,
title = {High performance microsystem packaging: A perspective},
author = {Romig, Jr, A D and Dressendorfer, P V and Palmer, D W},
abstractNote = {The second silicon revolution will be based on intelligent, integrated microsystems where multiple technologies (such as analog, digital, memory, sensor, micro-electro-mechanical, and communication devices) are integrated onto a single chip or within a multichip module. A necessary element for such systems is cost-effective, high-performance packaging. This paper examines many of the issues associated with the packaging of integrated microsystems, with an emphasis on the areas of packaging design, manufacturability, and reliability.},
doi = {},
url = {https://www.osti.gov/biblio/542031}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Oct 01 00:00:00 EDT 1997},
month = {Wed Oct 01 00:00:00 EDT 1997}
}

Conference:
Other availability
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