Method for producing high quality oxide films on substrates
Abstract
A method is described for providing an oxide film of a material on the surface of a substrate using a reactive deposition of the material onto the substrate surface in the presence of a solid or liquid layer of an oxidizing gas. The oxidizing gas is provided on the substrate surface in an amount sufficient to dissipate the latent heat of condensation occurring during deposition as well as creating a favorable oxidizing environment for the material. 4 figures.
- Inventors:
- Publication Date:
- OSTI Identifier:
- 5364578
- Patent Number(s):
- US 5264394; A
- Application Number:
- PPN: US 7-704097
- Assignee:
- Associated Universities, Inc., Washington, DC (United States)
- DOE Contract Number:
- AC02-76CH00016
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 22 May 1991
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; OXIDES; CHEMICAL VAPOR DEPOSITION; COMPOSITE MATERIALS; FABRICATION; FORMATION HEAT; OXIDIZERS; THIN FILMS; CHALCOGENIDES; CHEMICAL COATING; DEPOSITION; ENTHALPY; FILMS; MATERIALS; OXYGEN COMPOUNDS; PHYSICAL PROPERTIES; REACTION HEAT; SURFACE COATING; THERMODYNAMIC PROPERTIES; 360201* - Ceramics, Cermets, & Refractories- Preparation & Fabrication
Citation Formats
Ruckman, M W, Strongin, M, and Gao, Y L. Method for producing high quality oxide films on substrates. United States: N. p., 1993.
Web.
Ruckman, M W, Strongin, M, & Gao, Y L. Method for producing high quality oxide films on substrates. United States.
Ruckman, M W, Strongin, M, and Gao, Y L. 1993.
"Method for producing high quality oxide films on substrates". United States.
@article{osti_5364578,
title = {Method for producing high quality oxide films on substrates},
author = {Ruckman, M W and Strongin, M and Gao, Y L},
abstractNote = {A method is described for providing an oxide film of a material on the surface of a substrate using a reactive deposition of the material onto the substrate surface in the presence of a solid or liquid layer of an oxidizing gas. The oxidizing gas is provided on the substrate surface in an amount sufficient to dissipate the latent heat of condensation occurring during deposition as well as creating a favorable oxidizing environment for the material. 4 figures.},
doi = {},
url = {https://www.osti.gov/biblio/5364578},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 23 00:00:00 EST 1993},
month = {Tue Nov 23 00:00:00 EST 1993}
}
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