Enhanced J{sub c} and improved grain-boundary properties in Ag-doped YBa{sub 2}Cu{sub 3}O{sub 7{minus}{delta}} films

Journal Article · Tue Jul 01 00:00:00 EDT 1997 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.119452· OSTI ID:531713

Selvam, P ^[1]; Seibt, E W ^[2]; Kumar, D; Pinto, R; Apte, P R ^[3]

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1. Department of Chemistry, Indian Institute of Technology, Powai, Bombay 400 076 (India)
2. Institut fuer Technische Physik, Forschungszentrum Karlsruhe, Postfach 3640, D-76021 Karlsruhe (Germany)
3. Tata Institute of Fundamental Research, Colaba, Bombay 400 005 (India)

A large increase ({approximately}8{times}) in critical current density, J{sub c}, was achieved for {ital in situ} laser ablated YBa{sub 2}Cu{sub 3}O{sub 7{minus}{delta}}{endash}Ag films. High-resolution Auger electron spectroscopic investigation indicates that the Ag-doped films are stoichiometric with a relatively low grain-boundary extension (8 nm) in contrast to undoped YBa{sub 2}Cu{sub 3}O{sub 7{minus}{delta}} films (32 nm). Further analysis suggests that the doped film contains a much lower silver content ({lt}0.15wt{percent}) than in the target material (5 wt{percent}). These observations are in excellent agreement with the temperature dependence of J{sub c}, the room-temperature resistivity, and the surface resistance results. Thus, J{sub c} enhancement in Ag-doped films can be attributed to their superior properties, viz., improved microstructure characteristics and the reduced resistive grain boundaries. {copyright} {ital 1997 American Institute of Physics.}

• OSTI ID: 531713
• Journal Information: Applied Physics Letters, Vol. 71, Issue 1; Other Information: PBD: Jul 1997
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
SUPERCONDUCTING FILMS
CRYSTAL DOPING
YTTRIUM COMPOUNDS
BARIUM COMPOUNDS
SILVER
GRAIN BOUNDARIES
AUGER EFFECT
STOICHIOMETRY
ELECTRIC CONDUCTIVITY
YTTRIUM OXIDES
BARIUM OXIDES
COPPER OXIDES
SILVER ADDITIONS
CRITICAL CURRENT
HIGH-TC SUPERCONDUCTORS
TEMPERATURE DEPENDENCE
MICROSTRUCTURE