Investigation of TiC/Si{sub 3}N{sub 4} and TiN-coated TiC/Si{sub 3}N{sub 4} composites
Conference
·
OSTI ID:530689
- National Cheng-Kung Univ., Taiwan (China)
- Chinese Naval Academy, Taiwan (China)
Silicon nitride containing various compositions of as received TiC and TiN-coated TiC were hot pressed at 1800{degrees}C for 1 h in a nitrogen atmosphere. In TiN-coated TiC/Si{sub 3}N{sub 4} composites, TiC reacted firstly with the TiN coating to form a titanium carbonitride interlayer at 1450{degrees}C, which essentially reduced further reactions between TiC and Si{sub 3}N{sub 4} and enhanced densification. TiN-coated TiC/Si{sub 3}N{sub 4} composites exhibited better densification, flexural strength and fracture toughness than those of as received TiC/Si{sub 3}N{sub 4}.
- OSTI ID:
- 530689
- Report Number(s):
- CONF-9604124-; TRN: 97:003389-0025
- Resource Relation:
- Conference: 98. annual meeting of the American Ceramic Society, Indianapolis, IN (United States), 14-17 Apr 1996; Other Information: PBD: 1996; Related Information: Is Part Of Ceramic transactions: Advances in ceramic-matrix composites III. Volume 74; Bansal, N.P.; Singh, J.P. [eds.]; PB: 667 p.
- Country of Publication:
- United States
- Language:
- English
Similar Records
Microstructure and chemical reaction in a Si[sub 3]N[sub 4]-TiC composite
Microstructure and short-term oxidation of hot-pressed Si sub 3 N sub 4 /ZrO sub 2 (Y sub 2 O sub 3 ) ceramics
Evidences for dilute solid solutions in the Si[sub 3]N[sub 4]-TiN system
Journal Article
·
Tue Mar 01 00:00:00 EST 1994
· Journal of the American Ceramic Society; (United States)
·
OSTI ID:530689
Microstructure and short-term oxidation of hot-pressed Si sub 3 N sub 4 /ZrO sub 2 (Y sub 2 O sub 3 ) ceramics
Journal Article
·
Wed Jan 01 00:00:00 EST 1992
· Journal of the American Ceramic Society; (United States)
·
OSTI ID:530689
Evidences for dilute solid solutions in the Si[sub 3]N[sub 4]-TiN system
Journal Article
·
Mon Aug 15 00:00:00 EDT 1994
· Scripta Metallurgica et Materialia; (United States)
·
OSTI ID:530689
+2 more