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Title: Kinetics of metal interlayer growth in polyimide films: metal distributions in the non-steady-state regime and with constraints of patterned boundaries

Journal Article · · J. Phys. Chem.; (United States)
DOI:https://doi.org/10.1021/j100311a029· OSTI ID:5286041

Metal interlayers may be deposited in preexisting polymer films by reduction of a metal salt solution which is allowed to diffuse into the bulk of the film from one of its surfaces. The reduction may be effected either by a reducing agent or by mobile electrons in an electrochemically active polymer. The interlayer is composed of microparticles whose spacial distribution within the polymer can vary dramatically depending upon specific process conditions. These morphological variations are illustrated for the case of silver deposition in polyimide film. A kinetic model is described which relates the metal distribution directly to the diffusion of reagents and a second-order reaction rate law. It can be shown that the dominant variations in experimentally observed morphologies are consequences of the relative magnitude of diffusion coefficients and reaction rate constants under various process conditions. The model also provides an accurate prediction of the more complex three-dimensional density distributions obtained when a patterned interlayer is created by means of two-dimensional regulation of the supply of reagents.

Research Organization:
E.I. du Pont de Nemours and Company, Wilmington, DE (USA)
OSTI ID:
5286041
Journal Information:
J. Phys. Chem.; (United States), Vol. 91:27
Country of Publication:
United States
Language:
English