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Title: High thermal expansion, sealing glass

Abstract

A glass composition is described for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, copper, and copper/beryllium alloys, which includes between about 10 and about 25 mole percent Na[sub 2]O, between about 10 and about 25 mole percent K[sub 2]O, between about 5 and about 15 mole percent Al[sub 2]O[sub 3], between about 35 and about 50 mole percent P[sub 2]O[sub 5] and between about 5 and about 15 mole percent of one of PbO, BaO, and mixtures thereof. The composition, which may also include between 0 and about 5 mole percent Fe[sub 2]O[sub 3] and between 0 and about 10 mole percent B[sub 2]O[sub 3], has a thermal expansion coefficient in a range of between about 160 and 210[times]10[sup [minus]7]/C and a dissolution rate in a range of between about 2[times]10[sup [minus]7] and 2[times]10[sup [minus]9]g/cm[sup 2]-min. This composition is suitable to hermetically seal to metallic electrical components which will be subjected to humid environments over an extended period of time.

Inventors:
;
Publication Date:
OSTI Identifier:
5242734
Patent Number(s):
US 5262364; A
Application Number:
PPN: US 7-764254
Assignee:
Dept. of Energy, Washington, DC (United States) SNL; EDB-94-055326
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Resource Relation:
Patent File Date: 23 Sep 1991
Country of Publication:
United States
Language:
English
Subject:
37 INORGANIC, ORGANIC, PHYSICAL AND ANALYTICAL CHEMISTRY; 36 MATERIALS SCIENCE; GLASS; CHEMICAL COMPOSITION; SOLUBILITY; THERMAL EXPANSION; SEALING MATERIALS; ALUMINIUM OXIDES; BARIUM OXIDES; BORON OXIDES; IRON OXIDES; LEAD OXIDES; METALS; PHOSPHORUS OXIDES; POTASSIUM OXIDES; SEALS; SODIUM OXIDES; ALKALI METAL COMPOUNDS; ALKALINE EARTH METAL COMPOUNDS; ALUMINIUM COMPOUNDS; BARIUM COMPOUNDS; BORON COMPOUNDS; CHALCOGENIDES; ELEMENTS; EXPANSION; IRON COMPOUNDS; LEAD COMPOUNDS; MATERIALS; OXIDES; OXYGEN COMPOUNDS; PHOSPHORUS COMPOUNDS; POTASSIUM COMPOUNDS; SODIUM COMPOUNDS; TRANSITION ELEMENT COMPOUNDS; 400201* - Chemical & Physicochemical Properties; 360606 - Other Materials- Physical Properties- (1992-)

Citation Formats

Brow, R.K., and Kovacic, L. High thermal expansion, sealing glass. United States: N. p., 1993. Web.
Brow, R.K., & Kovacic, L. High thermal expansion, sealing glass. United States.
Brow, R.K., and Kovacic, L. Tue . "High thermal expansion, sealing glass". United States. doi:.
@article{osti_5242734,
title = {High thermal expansion, sealing glass},
author = {Brow, R.K. and Kovacic, L.},
abstractNote = {A glass composition is described for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, copper, and copper/beryllium alloys, which includes between about 10 and about 25 mole percent Na[sub 2]O, between about 10 and about 25 mole percent K[sub 2]O, between about 5 and about 15 mole percent Al[sub 2]O[sub 3], between about 35 and about 50 mole percent P[sub 2]O[sub 5] and between about 5 and about 15 mole percent of one of PbO, BaO, and mixtures thereof. The composition, which may also include between 0 and about 5 mole percent Fe[sub 2]O[sub 3] and between 0 and about 10 mole percent B[sub 2]O[sub 3], has a thermal expansion coefficient in a range of between about 160 and 210[times]10[sup [minus]7]/C and a dissolution rate in a range of between about 2[times]10[sup [minus]7] and 2[times]10[sup [minus]9]g/cm[sup 2]-min. This composition is suitable to hermetically seal to metallic electrical components which will be subjected to humid environments over an extended period of time.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 16 00:00:00 EST 1993},
month = {Tue Nov 16 00:00:00 EST 1993}
}