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Title: Sectioning technique for demountable semiconductor samples

Journal Article · · J. Electrochem. Soc.; (United States)
DOI:https://doi.org/10.1149/1.2123878· OSTI ID:5197057

A sectioning technique is developed to circumvent problems associated with the conventional procedure. The new technique consists of wax mounting the sample in a suitable chuck followed by chemical-mechanical polishing using Nalcog slurry. Basic features of a chuck design and polishing characteristics, and some results of defect analysis of thin silicon sheets, afforded by this technique are briefly described. 1 ref.

Research Organization:
Motorola Inc, Phoenix, Ariz, USA
OSTI ID:
5197057
Journal Information:
J. Electrochem. Soc.; (United States), Vol. 129:2
Country of Publication:
United States
Language:
English