Sectioning technique for demountable semiconductor samples
Journal Article
·
· J. Electrochem. Soc.; (United States)
A sectioning technique is developed to circumvent problems associated with the conventional procedure. The new technique consists of wax mounting the sample in a suitable chuck followed by chemical-mechanical polishing using Nalcog slurry. Basic features of a chuck design and polishing characteristics, and some results of defect analysis of thin silicon sheets, afforded by this technique are briefly described. 1 ref.
- Research Organization:
- Motorola Inc, Phoenix, Ariz, USA
- OSTI ID:
- 5197057
- Journal Information:
- J. Electrochem. Soc.; (United States), Vol. 129:2
- Country of Publication:
- United States
- Language:
- English
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