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Title: The elemental interaction in the electrodeposited Pb-Sn/electroless Ni-P deposit/Al multilayer upon heat treatment

Abstract

The deposition of electroless nickel on aluminum is a relatively simple process. It is thus feasible to manufacture an electrodeposited solder bump on aluminum with the aid of an electroless nickel intermediate layer. The Al/electroless Ni/Pb-SN combination has been successfully developed in the present work. For this application, however, it is necessary to understand the possible interactions during protracted utilization of the multilayer combination. Nickel is reported to undergo the smallest rate of dissolution and the rate of reaction with solder among various materials is commonly applied in electronics. Thus, nickel has been applied as a diffusion barrier in electronic packaging. Electroless nickel is expected to have a similar barrier property. The interaction between nickel and electrodeposited tin forms Ni[sub 3]Sn[sub 4] at 190 C (12); Ni[sub 3]Sn is formed when the nickel surface is roughened. Ni[sub 3]Sn[sub 2] was found after soldering on electroless Ni-P. Despite all this work, there are still few investigations on the behavior of electrodeposited solder and electroless nickel deposits. The authors investigated the interphases formed in the Al/electroless Ni-P/Pb-Sn electro-deposit multilayer combination.

Authors:
;  [1]
  1. (National Cheng Kung Univ., Tainan (Taiwan, Province of China). Dept. of Materials Science and Engineering)
Publication Date:
OSTI Identifier:
5190314
Resource Type:
Journal Article
Journal Name:
Scripta Metallurgica et Materialia; (United States)
Additional Journal Information:
Journal Volume: 30:5; Journal ID: ISSN 0956-716X
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ALUMINIUM; COATINGS; LEAD; DEPOSITION; NICKEL; PHOSPHORUS; TIN; ELEMENTS; METALS; NONMETALS; TRANSITION ELEMENTS; 360101* - Metals & Alloys- Preparation & Fabrication

Citation Formats

Lin, K.L., and Chang, J.T.. The elemental interaction in the electrodeposited Pb-Sn/electroless Ni-P deposit/Al multilayer upon heat treatment. United States: N. p., 1994. Web. doi:10.1016/0956-716X(94)90429-4.
Lin, K.L., & Chang, J.T.. The elemental interaction in the electrodeposited Pb-Sn/electroless Ni-P deposit/Al multilayer upon heat treatment. United States. doi:10.1016/0956-716X(94)90429-4.
Lin, K.L., and Chang, J.T.. Tue . "The elemental interaction in the electrodeposited Pb-Sn/electroless Ni-P deposit/Al multilayer upon heat treatment". United States. doi:10.1016/0956-716X(94)90429-4.
@article{osti_5190314,
title = {The elemental interaction in the electrodeposited Pb-Sn/electroless Ni-P deposit/Al multilayer upon heat treatment},
author = {Lin, K.L. and Chang, J.T.},
abstractNote = {The deposition of electroless nickel on aluminum is a relatively simple process. It is thus feasible to manufacture an electrodeposited solder bump on aluminum with the aid of an electroless nickel intermediate layer. The Al/electroless Ni/Pb-SN combination has been successfully developed in the present work. For this application, however, it is necessary to understand the possible interactions during protracted utilization of the multilayer combination. Nickel is reported to undergo the smallest rate of dissolution and the rate of reaction with solder among various materials is commonly applied in electronics. Thus, nickel has been applied as a diffusion barrier in electronic packaging. Electroless nickel is expected to have a similar barrier property. The interaction between nickel and electrodeposited tin forms Ni[sub 3]Sn[sub 4] at 190 C (12); Ni[sub 3]Sn is formed when the nickel surface is roughened. Ni[sub 3]Sn[sub 2] was found after soldering on electroless Ni-P. Despite all this work, there are still few investigations on the behavior of electrodeposited solder and electroless nickel deposits. The authors investigated the interphases formed in the Al/electroless Ni-P/Pb-Sn electro-deposit multilayer combination.},
doi = {10.1016/0956-716X(94)90429-4},
journal = {Scripta Metallurgica et Materialia; (United States)},
issn = {0956-716X},
number = ,
volume = 30:5,
place = {United States},
year = {1994},
month = {3}
}