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Title: X-ray photoemission spectroscopy characterization of silicon surfaces after CF/sub 4//H/sub 2/ magnetron ion etching: Comparisons to reactive ion etching

Journal Article · · J. Vac. Sci. Technol., A; (United States)
DOI:https://doi.org/10.1116/1.575222· OSTI ID:5155432

Silicon surfaces subjected to CF/sub 4/H/sub 2/ magnetron ion etching (MIE) have been characterized by x-ray photoemission spectroscopy. Low-power-density (0.274 Wcm/sup 2/) 25-mTorr MIE plasmas cause fluorocarbon films on Si which are characterized by C--CF/sub x/, CF, CF/sub 2/, and CF/sub 3/ groups. Graphitic carbon and silicon carbon type bonding can also be observed at the filmsilicon interface. Thicker films are formed in hydrogen-rich CF/sub 4/H/sub 2/ etching gas mixtures. Carbonaceous films with significant chemical differences are produced under high-powerlow-pressure MIE operating conditions (1 Wcm/sup 2/ at 4 mTorr). These films are characterized primarily by C--CC--H type carbon and a very low intensity of highly fluorinated carbon groups. The carbonfluorine ratio is 0.8 for the films formed in a pure CF/sub 4/ magnetron discharge at a power density of 0.27 Wcm/sup 2/, similar to that of films formed in a conventional reactive ion etch plasma, whereas it is 2.2 for the films formed at a power density of 1 Wcm/sup 2/. The carbonaceous film formed during high-power MIE does not have a dominant role in determining the silicon etching behavior in contrast to fluorocarbon films formed under low-power MIE conditions which suppress the Si etch rate. This explains the lack of SiO/sub 2/Si etch selectivity observed under high-power MIE conditions using CF/sub 4/H/sub 2/ in contrast to low-power magnetron ion etching where SiO/sub 2/Si etch selectivity is achieved.

Research Organization:
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York 10598
OSTI ID:
5155432
Journal Information:
J. Vac. Sci. Technol., A; (United States), Vol. 6:3
Country of Publication:
United States
Language:
English