In situ STM study of (100) Cu electrodes in sulfuric acid solution in the presence of benzotriazole: Adsorption, Cu corrosion, and Cu deposition
- Univ. Ulm (Germany). Abteilung Oberflaechenchemie und Katalyse
Atomic-resolution in situ scanning tunneling microscopy (STM) observations of (100) Cu electrodes in H{sub 2}SO{sub 4} solution containing 10{sup {minus}6} to 10{sup {minus}4} M benzotriazole (BTA) are presented. At potentials {le} {minus}0.6 V vs. a Hg/Hg{sub 2}SO{sub 4} (K{sub 2}SO{sub 4} sat.) reference electrode ordered superstructures of a chemisorbed BTA adlayer as well as a disordered, chainlike structure, suggesting a polymerized BTA film, were observed. Cu corrosion commences at potentials {le} {minus}0.4 V by the formation of monoatomic etch pits and slow step flow etching, resulting in roughening of the Cu surface. On changing the potential back to {le} {minus}0.6 V the surface becomes level again due to redeposition of dissolved Cu at the Cu steps.
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 511930
- Journal Information:
- Journal of the Electrochemical Society, Vol. 144, Issue 5; Other Information: PBD: May 1997
- Country of Publication:
- United States
- Language:
- English
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