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Title: On-clip high frequency reliability and failure test structures

Abstract

Self-stressing test structures for realistic high frequency reliability characterizations. An on-chip high frequency oscillator, controlled by DC signals from off-chip, provides a range of high frequency pulses to test structures. The test structures provide information with regard to a variety of reliability failure mechanisms, including hot-carriers, electromigration, and oxide breakdown. The system is normally integrated at the wafer level to predict the failure mechanisms of the production integrated circuits on the same wafer. 22 figs.

Inventors:
;
Publication Date:
Research Org.:
AT&T Corporation
OSTI Identifier:
504963
Patent Number(s):
US 5,625,288/A/
Application Number:
PAN: 8-590,690
Assignee:
Sandia Corp., Albuquerque, NM (United States) SNL; SCA: 426000; PA: EDB-97:100237; SN: 97001815603
DOE Contract Number:
AC04-76DP00789
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 29 Apr 1997
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; INTEGRATED CIRCUITS; RELIABILITY; PERFORMANCE TESTING; OSCILLATORS; FAILURES

Citation Formats

Snyder, E.S., and Campbell, D.V. On-clip high frequency reliability and failure test structures. United States: N. p., 1997. Web.
Snyder, E.S., & Campbell, D.V. On-clip high frequency reliability and failure test structures. United States.
Snyder, E.S., and Campbell, D.V. Tue . "On-clip high frequency reliability and failure test structures". United States. doi:.
@article{osti_504963,
title = {On-clip high frequency reliability and failure test structures},
author = {Snyder, E.S. and Campbell, D.V.},
abstractNote = {Self-stressing test structures for realistic high frequency reliability characterizations. An on-chip high frequency oscillator, controlled by DC signals from off-chip, provides a range of high frequency pulses to test structures. The test structures provide information with regard to a variety of reliability failure mechanisms, including hot-carriers, electromigration, and oxide breakdown. The system is normally integrated at the wafer level to predict the failure mechanisms of the production integrated circuits on the same wafer. 22 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 29 00:00:00 EDT 1997},
month = {Tue Apr 29 00:00:00 EDT 1997}
}
  • Self-stressing test structures for realistic high frequency reliability characterizations. An on-chip high frequency oscillator, controlled by DC signals from off-chip, provides a range of high frequency pulses to test structures. The test structures provide information with regard to a variety of reliability failure mechanisms, including hot-carriers, electromigration, and oxide breakdown. The system is normally integrated at the wafer level to predict the failure mechanisms of the production integrated circuits on the same wafer.
  • This invention is a Dual In-line Package (DIP) test clip for use when troubleshooting circuits containing DIP integrated circuits. This test clip is a significant improvement over existing DIP test clips in that it has retractable pins which will permit troubleshooting without risk of accidentally shorting adjacent pins together when moving probes to different pins on energized circuits or when the probe is accidentally bumped while taking measurements.
  • This invention is a Dual In-Line Package (DIP) test clip for use when troubleshooting circuits containing DIP integrated circuits. This test clip is a significant improvement over existing DIP test clips in that it has retractable pins which will permit troubleshooting without risk of accidentally shorting adjacent pins together when moving probes to different pins on energized circuits or when the probe is accidentally bumped while taking measurements. 4 figs.
  • This invention is a Dual In-Line Package (DIP) test clip for use when troubleshooting circuits containing DIP integrated circuits. This test clip is a significant improvement over existing DIP test clips in that it has retractable pins which will permit troubleshooting without risk of accidentally shorting adjacent pins together when moving probes to different pins on energized circuits or when the probe is accidentally bumped while taking measurements.
  • An attachment for placement between a test specimen and a remote clip gage extensometer providing improved fracture toughness tests of materials at elevated temperature. Using a cylindrical tube and axial rod in new relationship, the device transfers the displacement signal of the fracture toughness test specimen directly to a clip gage extensometer located outside the high temperature furnace. Virtually frictionless operation is assured by having the test specimen center one end of the rod in one end of the tube, while the clip gage extensometer arms center the other end of the rod in the other end of the tube.more » By providing positive control over both ends of both rod and tube, the attachment may be operated in orientations other than vertical.« less