A method of calculating the temperature distribution of IC packages on a printed wiring board. Part 2; Heat-transfer coefficients of IC packages

Journal Article · Mon Jan 01 00:00:00 EST 1990 · Heat Transfer - Japanese Research; (United States)

OSTI ID:5041670

Yanagida, T ^[1]

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1. Mechanical Engineering Research Lab., Hitachi, Ltd. (JP)

This paper presents a calculation model of the heat-transfer coefficients of successive IC packages on a printed wiring board. The air temperature around any downstream package increases from the inlet air temperature by the thermal wake of its upstream packages and therefore the heat-transfer coefficient decreases. The air-temperature distribution behind a single package was discussed in a previous report. By superimposing the temperature increase behind the upstream packages, an equation to predict the heat-transfer coefficients is proposed. The predicted values agree well with the experimental results.

• OSTI ID: 5041670
• Journal Information: Heat Transfer - Japanese Research; (United States), Vol. 19:7; ISSN 0096-0802
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
PACKAGING
TEMPERATURE DISTRIBUTION
CALCULATION METHODS
EQUATIONS
HEAT TRANSFER
INTEGRATED CIRCUITS
ELECTRONIC CIRCUITS
ENERGY TRANSFER
MICROELECTRONIC CIRCUITS
420400* - Engineering- Heat Transfer & Fluid Flow