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Title: Modular package for cooling a laser diode array

Abstract

This patent describes an apparatus for actively cooling a diode with coolant pumped by a circulation system. It comprises a thin planar assembly thermally and electrically connected to a diode, an inlet corridor providing coolant to the assembly, an inlet manifold integral in the assembly, the inlet manifold providing coolant flow between the inlet corridor and the microchannels in the heat sink region, an outlet corridor removing coolant from the assembly, and an outlet manifold integral in the assembly, the outlet manifold providing coolant flow between the microchannels in the heat sink region and the outlet corridor, wherein the planar assembly further comprises a top layer, a middle layer, and a bottom layer bonded together; the top layer and the middle layer defining the microchannels in the heat sink region and the outlet manifold; the bottom layer and the middle layer defining the inlet manifold; and the middle layer comprising a slot between the inlet manifold and the microchannels in the heat sink region.

Inventors:
; ;
Publication Date:
OSTI Identifier:
5021687
Patent Number(s):
US 5105429; A
Application Number:
PPN: US 7-549509
Assignee:
Dept. of Energy, Washington, DC (United States)
Resource Type:
Patent
Resource Relation:
Patent File Date: 6 Jul 1990
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; SEMICONDUCTOR DIODES; COOLING; SEMICONDUCTOR LASERS; HEAT TRANSFER; CIRCULATING SYSTEMS; COOLANTS; ENERGY TRANSFER; LASERS; SEMICONDUCTOR DEVICES; SOLID STATE LASERS; 426002* - Engineering- Lasers & Masers- (1990-); 420400 - Engineering- Heat Transfer & Fluid Flow

Citation Formats

Mundinger, D C, Benett, W J, and Beach, R J. Modular package for cooling a laser diode array. United States: N. p., 1992. Web.
Mundinger, D C, Benett, W J, & Beach, R J. Modular package for cooling a laser diode array. United States.
Mundinger, D C, Benett, W J, and Beach, R J. Tue . "Modular package for cooling a laser diode array". United States.
@article{osti_5021687,
title = {Modular package for cooling a laser diode array},
author = {Mundinger, D C and Benett, W J and Beach, R J},
abstractNote = {This patent describes an apparatus for actively cooling a diode with coolant pumped by a circulation system. It comprises a thin planar assembly thermally and electrically connected to a diode, an inlet corridor providing coolant to the assembly, an inlet manifold integral in the assembly, the inlet manifold providing coolant flow between the inlet corridor and the microchannels in the heat sink region, an outlet corridor removing coolant from the assembly, and an outlet manifold integral in the assembly, the outlet manifold providing coolant flow between the microchannels in the heat sink region and the outlet corridor, wherein the planar assembly further comprises a top layer, a middle layer, and a bottom layer bonded together; the top layer and the middle layer defining the microchannels in the heat sink region and the outlet manifold; the bottom layer and the middle layer defining the inlet manifold; and the middle layer comprising a slot between the inlet manifold and the microchannels in the heat sink region.},
doi = {},
url = {https://www.osti.gov/biblio/5021687}, journal = {},
number = ,
volume = ,
place = {United States},
year = {1992},
month = {4}
}