Activated gas reactions with silicone and epoxy resins

Conference · Sun Jan 01 00:00:00 EST 1978

OSTI ID:5019009

DeLollis, N J

Activated gas plasma technology is widely used for the low temperature ashing of organic materials, for cleaning and etching organic and inorganic materials, and for increasing the surface energy of polymeric materials in preparation for bonding. While some studies have been made of the effect of gas plasmas on natural materials, considerable work remains to be done on the effect of gas plasmas on polymeric resins. This paper reports on the effect of argon and oxygen gas plasmas in terms of weight loss on silicone and epoxy resins. The variables studied are time, pressure and power level. An RTV silicone is very stable in that it shows no weight loss under the test conditions with either oxygen or argon. An epoxy resin has significantly greater weight loss in oxygen compared to argon. When pressure is variable, weight loss peaks out at 0.7 Torr. Weight loss with increase in power level seems to be linear. A rigid aromatic amine cured epoxy tends to be more stable and loses less weight under comparable conditions than does a flexibilized polyamide cured epoxy.

• Research Organization: Sandia Labs., Albuquerque, N.Mex. (USA)
• DOE Contract Number: EY-76-C-04-0789
• OSTI ID: 5019009
• Report Number(s): SAND-77-1429C; CONF-780502-3
• Resource Relation: Conference: 23. national SAMPE symposium, Anaheim, CA, USA, 2 May 1978
• Country of Publication: United States
• Language: English

Related Subjects

37 INORGANIC
ORGANIC
PHYSICAL AND ANALYTICAL CHEMISTRY
EPOXIDES
CHEMICAL REACTIONS
RESINS
SILICONES
OXYGEN
ARGON
GASES
PLASMA
CRYOGENIC FLUIDS
ELEMENTS
FLUIDS
NONMETALS
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
POLYMERS
RARE GASES
SILOXANES
400201* - Chemical & Physicochemical Properties