skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Silicon growth rate enhancement using trisilane in a laser direct-writing technique

Book ·
OSTI ID:490893
;  [1]
  1. C.N.E.T.-France Telecom, Meylan (France)

An argon-ion laser based direct-writing technique was used to deposit micron-size silicon lines from the decomposition of silane (SiH{sub 4}) and trisilane (Si{sub 3}H{sub 8}) gases. The substrates used were 0.1 {micro}m polysilicon/1 {micro}m silicon dioxide/<100> monosilicon multilayered structures. The vertical silicon deposition rate was investigated as a function of the laser-induced surface temperature and gas pressure. For temperatures ranging between 1,000 and 1,410 C, the pressure was varied in the range 5--250 mbar and 0.1--30 mbar for SiH{sub 4} and Si{sub 3}H{sub 8}, respectively. For both gases, three growth regimes could be distinguished according to precursor pressure. The deposition rates achieved using trisilane are far higher than those obtained with silane in spite of the use of a reduced gas pressure range. For a laser-induced surface temperature of 1,300 C and a precursor pressure of 10 mbar, the deposition rates achieved using SiH{sub 4} and Si{sub 3}H{sub 8} are, respectively, 0.42 and 20 {micro}m/s, representing an enhancement factor of 50 with the later.

OSTI ID:
490893
Report Number(s):
CONF-951155-; ISBN 1-55899-300-2; TRN: IM9729%%144
Resource Relation:
Conference: Fall meeting of the Materials Research Society (MRS), Boston, MA (United States), 27 Nov - 1 Dec 1995; Other Information: PBD: 1996; Related Information: Is Part Of Advanced laser processing of materials -- Fundamentals and applications; Singh, R. [ed.] [Univ. of Florida, Gainesville, FL (United States)]; Norton, D. [ed.] [Oak Ridge National Lab., TN (United States)]; Laude, L. [ed.] [Univ. of Mons-Hainaut, Mons (Belgium)]; Narayan, J. [ed.] [North Carolina State Univ., Raleigh, NC (United States)]; Cheung, J. [ed.] [Rockwell International Science Center, Thousand Oaks, CA (United States)]; PB: 693 p.; Materials Research Society symposium proceedings, Volume 397
Country of Publication:
United States
Language:
English

Similar Records

Comparative Study of Low-temperature PECVD of Amorphous Silicon using Mono-, Di-, Trisilane and Cyclohexasilane
Conference · Mon Jun 08 00:00:00 EDT 2009 · Proceedings of the 34th IEEE Photovoltaics Specialists Conference · OSTI ID:490893

Chemical vapor deposition of amorphous silicon films from disilane
Thesis/Dissertation · Wed Jan 01 00:00:00 EST 1986 · OSTI ID:490893

Extraction of kinetic parameters for the chemical vapor deposition of polycrystalline silicon at medium and low pressures
Journal Article · Thu Jul 01 00:00:00 EDT 1993 · Journal of the Electrochemical Society; (United States) · OSTI ID:490893