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Title: Alkaline cleaner replacement for printed wiring board fabrication

Abstract

A replacement alkaline cleaning chemistry was qualified for the copper cleaning process used to support printed wiring board fabrication. The copper cleaning process was used to prepare copper surfaces for enhancing the adhesion of dry film photopolymers (photoresists and solder masks) and acrylic adhesives. The alkaline chemistry was used to remove organic contaminates such as fingerprints.

Authors:
; ;
Publication Date:
Research Org.:
Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
481584
Report Number(s):
KCP-613-5926
ON: DE97052934; TRN: AHC29712%%127
DOE Contract Number:
AC04-76DP00613
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: Apr 1997
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; PRINTED CIRCUITS; DETERGENTS; MANUFACTURING; SURFACE CLEANING; ORGANIC COMPOUNDS; PERFORMANCE

Citation Formats

Goldammer, S.E., Pemberton, S.E., and Tucker, D.R. Alkaline cleaner replacement for printed wiring board fabrication. United States: N. p., 1997. Web. doi:10.2172/481584.
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Goldammer, S.E., Pemberton, S.E., & Tucker, D.R. Alkaline cleaner replacement for printed wiring board fabrication. United States. doi:10.2172/481584.
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Goldammer, S.E., Pemberton, S.E., and Tucker, D.R. Tue . "Alkaline cleaner replacement for printed wiring board fabrication". United States. doi:10.2172/481584. https://www.osti.gov/servlets/purl/481584.
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@article{osti_481584,
title = {Alkaline cleaner replacement for printed wiring board fabrication},
author = {Goldammer, S.E. and Pemberton, S.E. and Tucker, D.R.},
abstractNote = {A replacement alkaline cleaning chemistry was qualified for the copper cleaning process used to support printed wiring board fabrication. The copper cleaning process was used to prepare copper surfaces for enhancing the adhesion of dry film photopolymers (photoresists and solder masks) and acrylic adhesives. The alkaline chemistry was used to remove organic contaminates such as fingerprints.},
doi = {10.2172/481584},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 01 00:00:00 EST 1997},
month = {Tue Apr 01 00:00:00 EST 1997}
}
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Technical Report:
View Technical Report (6.66 MB)
DOI:  10.2172/481584
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    MacDermid`s Metex{reg_sign} Ultra Etch FL and modifications to the Ultra Etch FL chemistry were evaluated as replacements of a discontinued replenisher, Ultra Etch Aqueous. Ultra Etch FL with additions of water to lower the total alkalinity and ammonium chloride to maintain the chloride level was found to produce acceptable results and, in fact, had a similar chemical composition to Ultra Etch Aqueous.

  • ;
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  • A solvent containing the chlorinated hydrocarbon 1,1,1-trichloroethane, was previously used to clean printed wiring boards following the contouring and inspection operations. An alkaline detergent was selected and evaluated as a replacement. Tests showed the detergent produced an acceptable level of cleanliness (resistance readings greater than 2 megohm-centimeters).

  • A solvent containing the chlorinated hydrocarbon 1,1,1-trichloroethane, was previously used to clean printed wiring boards following the contouring and inspection operations. An alkaline detergent was selected and evaluated as a replacement. Tests showed the detergent produced an acceptable level of cleanliness (resistance readings greater than 2 megohm-centimeters).

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