High-temperature reactivity in the ZrW{sub 2}O{sub 8}-Cu system
- Massachusetts Inst. of Tech., Cambridge, MA (United States). Dept. of Materials Science and Engineering
Zirconium tungstate (ZrW{sub 2}O{sub 8}) exhibits the unusual property of a negative coefficient of thermal expansion (CTE) over a wide range of temperature, from 0.3 to 1,050 K. As a reinforcement in a composite, zirconium tungstate can reduce the overall thermal expansion of the composite much more effectively than a ceramic with positive CTE. If a metallic matrix is used, the resulting composite will also exhibit high thermal conductivity, with applications such as heat sink for microelectronics devices (CTE matching that of silicon or alumina) or high precision optical elements subjected to thermal fluctuation (zero CTE). As a matrix, copper is prime candidate, because it has the second highest thermal conductivity of all metals after silver, and because it can be easily processed within the temperature window imposed by the metastability of ZrW{sub 2}O{sub 8}. Moreover, copper is already widely used in electronics industry and can be easily soldered. In the present work, the authors investigate the stability of ZrW{sub 2}O{sub 8} when hot-isostatically pressed with copper, in order to explore the processing feasibility of a low thermal expansion, high conductivity ZrW{sub 2}O{sub 8}-Cu composite.
- OSTI ID:
- 474225
- Journal Information:
- Scripta Materialia, Vol. 36, Issue 9; Other Information: PBD: 1 May 1997
- Country of Publication:
- United States
- Language:
- English
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