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Title: The influence of microstructure on the mechanical properties of solder

Abstract

Solder joints in microelectronics devices consist of low-melting solder compositions that wet and join metal contacts and are, ordinarily, used at high homologous temperatures in the as-solidified condition. Differences in solidification rate and substrate interactions have the consequence that even solder joints of similar compositions exhibit a wide range of microstructures. The variation in microstructure causes a variation in properties; in particular, the high-temperature creep properties that govern much of the mechanical behavior of the solder may differ significantly from joint to joint. The present paper reviews the varieties of microstructure that are found in common solder joints, and describes some of the ways in which microstructural changes affect mechanical properties and joint reliability.

Authors:
;
Publication Date:
Research Org.:
Lawrence Berkeley Lab., CA (United States). Materials Science Div.
Sponsoring Org.:
USDOE Office of Energy Research, Washington, DC (United States)
OSTI Identifier:
459918
Report Number(s):
LBNL-39178; CONF-9606176-2
ON: DE97004220; TRN: 97:002385
DOE Contract Number:
AC03-76SF00098
Resource Type:
Conference
Resource Relation:
Conference: 8. Society for Experimental Mechanics (SEM) international congress on experimental mechanics, Nashville, TN (United States), 10-13 Jun 1996; Other Information: PBD: Jun 1996
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; SOLDERED JOINTS; MECHANICAL PROPERTIES; LEAD; CREEP; MICROSTRUCTURE; TIN; COPPER; NICKEL; SOLIDIFICATION; FATIGUE

Citation Formats

Morris, J.W. Jr., and Reynolds, H.L. The influence of microstructure on the mechanical properties of solder. United States: N. p., 1996. Web.
Morris, J.W. Jr., & Reynolds, H.L. The influence of microstructure on the mechanical properties of solder. United States.
Morris, J.W. Jr., and Reynolds, H.L. Sat . "The influence of microstructure on the mechanical properties of solder". United States. doi:. https://www.osti.gov/servlets/purl/459918.
@article{osti_459918,
title = {The influence of microstructure on the mechanical properties of solder},
author = {Morris, J.W. Jr. and Reynolds, H.L.},
abstractNote = {Solder joints in microelectronics devices consist of low-melting solder compositions that wet and join metal contacts and are, ordinarily, used at high homologous temperatures in the as-solidified condition. Differences in solidification rate and substrate interactions have the consequence that even solder joints of similar compositions exhibit a wide range of microstructures. The variation in microstructure causes a variation in properties; in particular, the high-temperature creep properties that govern much of the mechanical behavior of the solder may differ significantly from joint to joint. The present paper reviews the varieties of microstructure that are found in common solder joints, and describes some of the ways in which microstructural changes affect mechanical properties and joint reliability.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Jun 01 00:00:00 EDT 1996},
month = {Sat Jun 01 00:00:00 EDT 1996}
}

Conference:
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