The influence of microstructure on the mechanical properties of solder
Abstract
Solder joints in microelectronics devices consist of low-melting solder compositions that wet and join metal contacts and are, ordinarily, used at high homologous temperatures in the as-solidified condition. Differences in solidification rate and substrate interactions have the consequence that even solder joints of similar compositions exhibit a wide range of microstructures. The variation in microstructure causes a variation in properties; in particular, the high-temperature creep properties that govern much of the mechanical behavior of the solder may differ significantly from joint to joint. The present paper reviews the varieties of microstructure that are found in common solder joints, and describes some of the ways in which microstructural changes affect mechanical properties and joint reliability.
- Authors:
- Publication Date:
- Research Org.:
- Lawrence Berkeley Lab., CA (United States). Materials Science Div.
- Sponsoring Org.:
- USDOE Office of Energy Research, Washington, DC (United States)
- OSTI Identifier:
- 459918
- Report Number(s):
- LBNL-39178; CONF-9606176-2
ON: DE97004220; TRN: 97:002385
- DOE Contract Number:
- AC03-76SF00098
- Resource Type:
- Conference
- Resource Relation:
- Conference: 8. Society for Experimental Mechanics (SEM) international congress on experimental mechanics, Nashville, TN (United States), 10-13 Jun 1996; Other Information: PBD: Jun 1996
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; SOLDERED JOINTS; MECHANICAL PROPERTIES; LEAD; CREEP; MICROSTRUCTURE; TIN; COPPER; NICKEL; SOLIDIFICATION; FATIGUE
Citation Formats
Morris, J.W. Jr., and Reynolds, H.L.. The influence of microstructure on the mechanical properties of solder. United States: N. p., 1996.
Web.
Morris, J.W. Jr., & Reynolds, H.L.. The influence of microstructure on the mechanical properties of solder. United States.
Morris, J.W. Jr., and Reynolds, H.L.. Sat .
"The influence of microstructure on the mechanical properties of solder". United States.
doi:. https://www.osti.gov/servlets/purl/459918.
@article{osti_459918,
title = {The influence of microstructure on the mechanical properties of solder},
author = {Morris, J.W. Jr. and Reynolds, H.L.},
abstractNote = {Solder joints in microelectronics devices consist of low-melting solder compositions that wet and join metal contacts and are, ordinarily, used at high homologous temperatures in the as-solidified condition. Differences in solidification rate and substrate interactions have the consequence that even solder joints of similar compositions exhibit a wide range of microstructures. The variation in microstructure causes a variation in properties; in particular, the high-temperature creep properties that govern much of the mechanical behavior of the solder may differ significantly from joint to joint. The present paper reviews the varieties of microstructure that are found in common solder joints, and describes some of the ways in which microstructural changes affect mechanical properties and joint reliability.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Jun 01 00:00:00 EDT 1996},
month = {Sat Jun 01 00:00:00 EDT 1996}
}