Behavior of copper in acidic sulfate solution: Comparison with acidic chloride
- Univ. of British Columbia, Vancouver, British Columbia (Canada). Dept. of Metals and Materials Engineering
The anodic polarization behavior of copper in a 0.1 M sulfuric acid (H{sub 2}SO{sub 4}) + 1 M sodium sulfate (Na{sub 2}SO{sub 4}) solution (pH = 2.0) was studied at room temperature under quiescent and stirred conditions. The behavior was compared with aqueous equilibria via construction of a potential-vs-pH (E-pH) diagram for the copper-sulfate-water (Cu-SO{sub 4}{sup 2}-H{sub 2}O) system. Interpretation of the behavior was aided by comparison with aqueous equilibria and polarization studies of copper in a 0.2 M hydrochloric acid (HCl) + 1 M sodium chloride (NaCl) solution(pH = 0.8). The initial anodic dissolution region in the acidic sulfate solution exhibited Tafel behavior with a slope consistent with formation of cupric ions (Cu{sup 2+}) whose rate of formation was charge-transfer controlled. At higher potentials, limiting current density (i{sub L}) behavior was observed under E-pH conditions that were consistent with formation of a film of copper sulfate pentahydrate (CuSO{sub 4} {degree} 5H{sub 2}O). Comparison of experimental i{sub L} values with those predicted by mass transport-controlled processes, using estimates of the diffusion layer thickness obtained from the mass transfer-influenced region of apparent Tafel behavior in the acidic chloride solution, were in sufficient agreement to indicate i{sub L} was controlled by the rate of dissolution of the CuSO{sub 4} {degree} 5H{sub 2}O film via transport of Cu{sup 2+} from the film-electrolyte interface into the bulk solution.
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 458215
- Journal Information:
- Corrosion, Vol. 53, Issue 3; Other Information: PBD: Mar 1997
- Country of Publication:
- United States
- Language:
- English
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