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Title: Copper deposition in the presence of surface-confined additives

Abstract

The galvanostatic deposition of Cu from sulfuric acid solutions onto evaporated (111) Au electrodes bearing alkanethiol monolayers (SAMs) was studied with a combination of cyclic voltammetry, in situ atomic force microscopy, and X-ray photoelectron spectroscopy. The morphology of the electrodeposit was found to depend on the chain length of the alkanethiol used to form the SAM and the applied current density. It was found that short chain length (n - 4) thiols and high current densities (j {ge} 1.67 mA/cm{sup 2}) promote the formation of smooth deposits. The authors attribute this effect to the overpotential-driven activation of numerous monolayer defects that play the role of nucleation centers. The passage of the current was found to cause a change in the monolayer in a completely reversible manner and that the deposition and subsequent stripping did not affect the S-Au bond of most thiolate moieties contained in the SAM. The implications of these results for additive-based electrodeposition are discussed.

Authors:
; ; ;  [1]
  1. Univ. of Illinois, Urbana, IL (United States)
Publication Date:
Sponsoring Org.:
National Science Foundation, Washington, DC (United States)
OSTI Identifier:
452215
DOE Contract Number:  
FG02-91ER45439
Resource Type:
Journal Article
Journal Name:
Journal of the Electrochemical Society
Additional Journal Information:
Journal Volume: 144; Journal Issue: 1; Other Information: PBD: Jan 1997
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COPPER; ELECTRODEPOSITION; SULFURIC ACID; ELECTRODEPOSITED COATINGS; MORPHOLOGY; THIOLS; MOLECULAR WEIGHT; ADDITIVES

Citation Formats

Eliadis, E D, Nuzzo, R G, Gewirth, A A, and Alkire, R C. Copper deposition in the presence of surface-confined additives. United States: N. p., 1997. Web. doi:10.1149/1.1837370.
Eliadis, E D, Nuzzo, R G, Gewirth, A A, & Alkire, R C. Copper deposition in the presence of surface-confined additives. United States. doi:10.1149/1.1837370.
Eliadis, E D, Nuzzo, R G, Gewirth, A A, and Alkire, R C. Wed . "Copper deposition in the presence of surface-confined additives". United States. doi:10.1149/1.1837370.
@article{osti_452215,
title = {Copper deposition in the presence of surface-confined additives},
author = {Eliadis, E D and Nuzzo, R G and Gewirth, A A and Alkire, R C},
abstractNote = {The galvanostatic deposition of Cu from sulfuric acid solutions onto evaporated (111) Au electrodes bearing alkanethiol monolayers (SAMs) was studied with a combination of cyclic voltammetry, in situ atomic force microscopy, and X-ray photoelectron spectroscopy. The morphology of the electrodeposit was found to depend on the chain length of the alkanethiol used to form the SAM and the applied current density. It was found that short chain length (n - 4) thiols and high current densities (j {ge} 1.67 mA/cm{sup 2}) promote the formation of smooth deposits. The authors attribute this effect to the overpotential-driven activation of numerous monolayer defects that play the role of nucleation centers. The passage of the current was found to cause a change in the monolayer in a completely reversible manner and that the deposition and subsequent stripping did not affect the S-Au bond of most thiolate moieties contained in the SAM. The implications of these results for additive-based electrodeposition are discussed.},
doi = {10.1149/1.1837370},
journal = {Journal of the Electrochemical Society},
number = 1,
volume = 144,
place = {United States},
year = {1997},
month = {1}
}