Behavior of interfacial phases in diffusion bonding of commercial aluminum alloys by transmission electron microscopy
- Industrial Research Inst. of Aichi Prefecture, Kariya, Aichi (Japan)
- Osaka Univ., Ibaraki, Osaka (Japan). Welding Research Inst.
The behavior of the superficial oxide film at the diffusion-bonded interface of Al alloys including Mg, Si, Cu, and Zn has been investigated by TEM observations to explain the effect of the alloying elements on the bondability of the Al alloy. The oxide remaining at the bond interface at bonding temperatures {approximately}873 K could be classified by Mg content C{sub Mg}: amorphous oxide films at C{sub Mg} {le} 0.01%, crystalline particles of Al{sub 2}MgO{sub 4} at 0.3% {le} C{sub Mg} < 1%, and crystalline particles of MgO at 1% < C{sub Mg}. At low bonding temperatures, the amorphous oxide film was observed on the bond interfaces of all the alloys employed, but the crystalline oxide particle became dominant with increasing the bonding temperature. The joint of the alloys with C{sub Mg} {ge} 0.3% had tensile strength significantly higher than those with C{sub Mg} {le} 0.01%, suggesting that the morphology of the oxide is a controlling factor of the bond formation in the diffusion bonding process of the Al alloy.
- OSTI ID:
- 443016
- Report Number(s):
- CONF-950682-; ISBN 0-87170-567-2; TRN: IM9712%%441
- Resource Relation:
- Conference: 4. international conference on trends in welding research, Gatlinburg, TN (United States), 5-9 Jun 1995; Other Information: PBD: 1996; Related Information: Is Part Of Trends in welding research: Proceedings of the 4. international conference; Smartt, H.B.; Johnson, J.A. [eds.] [Idaho National Engineering Lab., Idaho Falls, ID (United States)]; David, S.A. [ed.] [Oak Ridge National Lab., TN (United States)]; PB: 836 p.
- Country of Publication:
- United States
- Language:
- English
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