Development of MC2730 RTG thermopile side contact attachment process
Abstract
Gold plated Kovar pads were eutectic bonded to p and n-type SiGe specimens using a 98 wt% AuSi preform alloy. This joining technique was shown to yield strong reliable bonds. A method based on this technique is described for producing bonding pads to the outermost elements of the MC2730 RTG thermopile. (auth)
- Authors:
- Publication Date:
- Research Org.:
- Sandia Labs., Albuquerque, N.Mex. (USA)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 4353575
- Report Number(s):
- SLA-73-659
- NSA Number:
- NSA-29-020778
- DOE Contract Number:
- AT(29-1)-789
- Resource Type:
- Technical Report
- Resource Relation:
- Other Information: Orig. Receipt Date: 30-JUN-74
- Country of Publication:
- United States
- Language:
- English
- Subject:
- N42100* -Engineering-Energy Conversion; *THERMOCOUPLES- WELDING; *THERMOELECTRIC GENERATORS- THERMOCOUPLES; EUTECTICS; GERMANIUM; GOLD ALLOYS; SILICON; SILICON ALLOYS; NESDPS Office of Nuclear Energy Space and Defense Power Systems
Citation Formats
Yost, F.G.. Development of MC2730 RTG thermopile side contact attachment process. United States: N. p., 1973.
Web. doi:10.2172/4353575.
Yost, F.G.. Development of MC2730 RTG thermopile side contact attachment process. United States. doi:10.2172/4353575.
Yost, F.G.. Sat .
"Development of MC2730 RTG thermopile side contact attachment process". United States.
doi:10.2172/4353575. https://www.osti.gov/servlets/purl/4353575.
@article{osti_4353575,
title = {Development of MC2730 RTG thermopile side contact attachment process},
author = {Yost, F.G.},
abstractNote = {Gold plated Kovar pads were eutectic bonded to p and n-type SiGe specimens using a 98 wt% AuSi preform alloy. This joining technique was shown to yield strong reliable bonds. A method based on this technique is described for producing bonding pads to the outermost elements of the MC2730 RTG thermopile. (auth)},
doi = {10.2172/4353575},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Sep 01 00:00:00 EDT 1973},
month = {Sat Sep 01 00:00:00 EDT 1973}
}
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Metallization and photolithographic processes and procedures for MC2730 RTG thermopile intraconnections
Processes and procedures were developed for applying the thin film tungsten electrical intraconnections to the MC2730 RTG ''one-dimensional'' thermopile. After polishing, the surface to be metallized was cleaned with a detergent/organic solvent procedure and then etched with hydrofluoric acid to minimize the oxide. Tungsten contacts were sputtered onto the thermopile and the individual contacts photolithographically defined using a negative acting photoresist in conjunction with a potassium ferricyanide etchant. The processes were used to process 89 thermopiles with an 80 percent effective yield. -
900-755 degradation model for an RTG with a silicon-germanium thermopile. [DEGRA computer code]
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