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Title: THE MATERIAL TRANSPORT MECHANISM DURING SINTERING OF COPPER POWDER COMPACTS AT HIGH TEMPERATURES

Abstract

The isothermal shrinkage rates of copper powder compacts were determined in the temperature range from 780 to 1080 deg C. The rates for compacts from a pure spherical copper powder were compared, on the one hand, with those from a spherical powder with a dispersion of aluminum oxide in the copper matrix and, on the other hand, with those from a pure copper powder having irregularly shaped particles. The irregular copper powder compacts shrank much faster than the spherical copper powder compacts and these, in turn, shrank faster than dispersion strengthened copper powder compacts. The experiments were run under a small external load. By varying this load, the stress dependence of the isothermal shrinkage rate could be measured for compacts from spherical copper powders. This stress dependence was found to be approximately proportional to the 4th (Dispersion strengthened alloys) or 4.5th (pure metals) power of the stress. It is concluded that the material transport mechanism is due to dislocation climb rather than to Herring-Nabarro creep. (auth)

Authors:
; ;
Publication Date:
Research Org.:
Rensselaer Polytechnic Inst., Troy, N.Y.
OSTI Identifier:
4079044
Report Number(s):
TID-20324
NSA Number:
NSA-18-015716
DOE Contract Number:  
AT(30-1)-1995
Resource Type:
Technical Report
Resource Relation:
Other Information: Orig. Receipt Date: 31-DEC-64
Country of Publication:
United States
Language:
English
Subject:
GENERAL AND MISCELLANEOUS; CONFIGURATION; COPPER; HIGH TEMPERATURE; PARTICLES; POWDERS; SHRINKAGE; SINTERED MATERIALS; SINTERING; STRESSES; TRANSPORT

Citation Formats

Early, J G, Lenel, F V, and Ansell, G S. THE MATERIAL TRANSPORT MECHANISM DURING SINTERING OF COPPER POWDER COMPACTS AT HIGH TEMPERATURES. United States: N. p., 1963. Web.
Early, J G, Lenel, F V, & Ansell, G S. THE MATERIAL TRANSPORT MECHANISM DURING SINTERING OF COPPER POWDER COMPACTS AT HIGH TEMPERATURES. United States.
Early, J G, Lenel, F V, and Ansell, G S. Tue . "THE MATERIAL TRANSPORT MECHANISM DURING SINTERING OF COPPER POWDER COMPACTS AT HIGH TEMPERATURES". United States.
@article{osti_4079044,
title = {THE MATERIAL TRANSPORT MECHANISM DURING SINTERING OF COPPER POWDER COMPACTS AT HIGH TEMPERATURES},
author = {Early, J G and Lenel, F V and Ansell, G S},
abstractNote = {The isothermal shrinkage rates of copper powder compacts were determined in the temperature range from 780 to 1080 deg C. The rates for compacts from a pure spherical copper powder were compared, on the one hand, with those from a spherical powder with a dispersion of aluminum oxide in the copper matrix and, on the other hand, with those from a pure copper powder having irregularly shaped particles. The irregular copper powder compacts shrank much faster than the spherical copper powder compacts and these, in turn, shrank faster than dispersion strengthened copper powder compacts. The experiments were run under a small external load. By varying this load, the stress dependence of the isothermal shrinkage rate could be measured for compacts from spherical copper powders. This stress dependence was found to be approximately proportional to the 4th (Dispersion strengthened alloys) or 4.5th (pure metals) power of the stress. It is concluded that the material transport mechanism is due to dislocation climb rather than to Herring-Nabarro creep. (auth)},
doi = {},
url = {https://www.osti.gov/biblio/4079044}, journal = {},
number = ,
volume = ,
place = {United States},
year = {1963},
month = {1}
}

Technical Report:
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