skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Method for the determination of bulk and interface density of states in thin-film transistors

Abstract

In this article we present a method for the accurate determination of interface and bulk density of states (DOS) in thin-film transistors (TFTs), based on the combined analysis of transfer (I{sub D}{endash}V{sub GS}) and capacitance{endash}voltage characteristics. This analysis has achieved a number of results, eliminating sources of inaccuracies that are known to be present in other methods. A procedure for the determination of the electron and hole flatband conductances and bulk Fermi energy is demonstrated. A recursive procedure is employed to extract the bulk DOS directly from Poisson{close_quote}s equation. The advantages of this method are the greater immunity to noise from the original data, the use of the complete Fermi function (no 0 K approximation), and the applicability to thin active layers. This method yields the interface state density spectrum as well as the bulk DOS. This information is very important for device design, process characterization, and modeling of TFTs. {copyright} 2001 American Institute of Physics.

Authors:
; ; ;
Publication Date:
Sponsoring Org.:
(US)
OSTI Identifier:
40203782
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Applied Physics; Journal Volume: 89; Journal Issue: 11; Other Information: DOI: 10.1063/1.1361244; Othernumber: JAPIAU000089000011006453000001; 009110JAP; PBD: 1 Jun 2001
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; BULK DENSITY; DESIGN; ELECTRONS; IMMUNITY; PHYSICS; TRANSISTORS

Citation Formats

Lui, O. K. B., Tam, S. W.-B., Migliorato, P., and Shimoda, T.. Method for the determination of bulk and interface density of states in thin-film transistors. United States: N. p., 2001. Web. doi:10.1063/1.1361244.
Lui, O. K. B., Tam, S. W.-B., Migliorato, P., & Shimoda, T.. Method for the determination of bulk and interface density of states in thin-film transistors. United States. doi:10.1063/1.1361244.
Lui, O. K. B., Tam, S. W.-B., Migliorato, P., and Shimoda, T.. 2001. "Method for the determination of bulk and interface density of states in thin-film transistors". United States. doi:10.1063/1.1361244.
@article{osti_40203782,
title = {Method for the determination of bulk and interface density of states in thin-film transistors},
author = {Lui, O. K. B. and Tam, S. W.-B. and Migliorato, P. and Shimoda, T.},
abstractNote = {In this article we present a method for the accurate determination of interface and bulk density of states (DOS) in thin-film transistors (TFTs), based on the combined analysis of transfer (I{sub D}{endash}V{sub GS}) and capacitance{endash}voltage characteristics. This analysis has achieved a number of results, eliminating sources of inaccuracies that are known to be present in other methods. A procedure for the determination of the electron and hole flatband conductances and bulk Fermi energy is demonstrated. A recursive procedure is employed to extract the bulk DOS directly from Poisson{close_quote}s equation. The advantages of this method are the greater immunity to noise from the original data, the use of the complete Fermi function (no 0 K approximation), and the applicability to thin active layers. This method yields the interface state density spectrum as well as the bulk DOS. This information is very important for device design, process characterization, and modeling of TFTs. {copyright} 2001 American Institute of Physics.},
doi = {10.1063/1.1361244},
journal = {Journal of Applied Physics},
number = 11,
volume = 89,
place = {United States},
year = 2001,
month = 6
}
  • This study investigates the effect of hafnium doping on the density of states (DOSs) in HfZnSnO thin film transistors fabricated by dual-target magnetron co-sputtering system. The DOSs is extracted by temperature-dependent field-effect measurements, and they decrease from 1.1 × 10{sup 17} to 4.6 × 10{sup 16 }eV/cm{sup 3} with increasing the hafnium concentrations. The behavior of DOSs for the increasing hafnium concentration HfZnSnO thin film transistors can be confirmed by both the reduction of ΔV{sub T} under bias stress and the trapping charges calculated by capacitance voltage measurements. It suggests that the reduction in DOSs due to the hafnium doping is closely related with themore » bias stability and thermal stability.« less
  • To avoid the problem of air sensitive and wet-etched Zn and/or Ga contained amorphous oxide transistors, we propose an alternative amorphous semiconductor of indium silicon tungsten oxide as the channel material for thin film transistors. In this study, we employ the material to reveal the relation between the active thin film and the transistor performance with aid of x-ray reflectivity study. By adjusting the pre-annealing temperature, we find that the film densification and interface flatness between the film and gate insulator are crucial for achieving controllable high-performance transistors. The material and findings in the study are believed helpful for realizingmore » controllable high-performance stable transistors.« less
  • No abstract prepared.
  • We have studied the effect of long time post-fabrication annealing on negative bias illumination stress (NBIS) of amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film-transistors. Annealing for 100 h at 250 °C increased the field effect mobility from 14.7 cm{sup 2}/V s to 17.9 cm{sup 2}/V s and reduced the NBIS instability remarkably. Using X-ray photoelectron spectroscopy, the oxygen vacancy and OH were found to exist at the interfaces of a-IGZO with top and bottom SiO{sub 2}. Long time annealing helps to decrease the vacancy concentration and increase the metal-oxygen bonds at the interfaces; this leads to increase in the free carrier concentrations in a-IGZO and field-effect mobility.more » X-ray reflectivity measurement indicated the increment of a-IGZO film density of 5.63 g cm{sup −3} to 5.83 g cm{sup −3} (3.4% increase) by 100 h annealing at 250 °C. The increase in film density reveals the decrease of O vacancy concentration and reduction of weak metal-oxygen bonds in a-IGZO, which substantially helps to improve the NBIS stability.« less
  • After fabrication of Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) devices on high-index silicon (114) surfaces, their threshold voltage (Vth) and interface-states density (Dit) characteristics were measured under the influence of an externally applied magnetic field of B = 6 μT at room temperature. The electron flow of the MOSFET's channel presents high anisotropy on Si (114), and this effect is enhanced by using an external magnetic field B, applied parallel to the Si (114) surface but perpendicular to the electron flow direction. This special configuration results in the channel electrons experiencing a Lorentzian force which pushes the electrons closer to the Si (114)-SiO{sub 2} interfacemore » and therefore to the special morphology of the Si (114) surface. Interestingly, Dit evaluation of n-type MOSFETs fabricated on Si (114) surfaces shows that the Si (114)-SiO{sub 2} interface is of high quality so that Dit as low as ∼10{sup 10 }cm{sup −2}·eV{sup −1} are obtained for MOSFETs with channels aligned at specific orientations. Additionally, using both a small positive Vds ≤ 100 mV and B = 6 μT, the former Dit is reduced by 35% in MOSFETs whose channels are aligned parallel to row-like nanostructures formed atop Si (114) surfaces (channels having a 90° rotation), whereas Dit is increased by 25% in MOSFETs whose channels are aligned perpendicular to these nanostructures (channels having a 0° rotation). From these results, the special morphology of a high-index Si (114) plane having nanochannels on its surface opens the possibility to reduce the electron-trapping characteristics of MOSFET devices having deep-submicron features and operating at very high frequencies.« less