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Title: Thermal management of power electronic circuits using thermoelectric coolers and diamond films

Abstract

The increased speeds of integrated circuits is accompanied by increased power levels and the need to package the IC chips very close together. Combined, these spell very high power densities and severe thermal problems at the package level. Conventional packaging materials have difficulty dealing with these thermal management problems. However, it is possible to combine both active and passive cooling by using thin film bismuth-telluride thermoelectric coolers (microcoolers) and diamond substrates for the temperature control of these high density electronic circuits. The highest power components would be mounted directly onto thin film thermoelectric elements, which would maintain the temperature of these components from a few degrees to tens of degrees below that of the diamond substrate. This allows these components to operate within their required temperature range, effectively manage temperature spikes and junction temperatures, and increase clockspeed. To optimize the design of the thermoelectric cooler and operate at maximum efficiency, diamond films acting as thermal lenses would also be used to spread the heat from the small power device to the larger coolers. In those instances where the devices are all operating above ambient temperature, high thermal conductivity diamond films alone are sufficient to cool these devices, by effectively conductingmore » the heat throughout the board.« less

Authors:
; ;  [1];  [2]
  1. California Inst. of Tech., Pasadena, CA (United States). Jet Propulsion Lab.
  2. Marlow Industries, Inc., Dallas, TX (United States)
Publication Date:
OSTI Identifier:
400875
Report Number(s):
CONF-950828-
Journal ID: ISSN 0065-8812; TRN: IM9650%%281
Resource Type:
Conference
Resource Relation:
Conference: 1995 National heat transfer conference, Portland, OR (United States), 5-9 Aug 1995; Other Information: PBD: 1995; Related Information: Is Part Of Heat transfer -- Portland 1995; El-Genk, M.S. [ed.] [Univ. of New Mexico, Albuquerque, NM (United States)]; PB: 378 p.; AIChE Symposium Series, Volume 91, Number 306
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; 30 DIRECT ENERGY CONVERSION; 36 MATERIALS SCIENCE; INTEGRATED CIRCUITS; TEMPERATURE CONTROL; THERMOELECTRIC COOLERS; DESIGN; DIAMONDS; THERMAL CONDUCTIVITY; OPTIMIZATION; THIN FILMS

Citation Formats

Vandersande, J W, Ewell, R, Fleurial, J P, and Lyon, H B. Thermal management of power electronic circuits using thermoelectric coolers and diamond films. United States: N. p., 1995. Web.
Vandersande, J W, Ewell, R, Fleurial, J P, & Lyon, H B. Thermal management of power electronic circuits using thermoelectric coolers and diamond films. United States.
Vandersande, J W, Ewell, R, Fleurial, J P, and Lyon, H B. Sun . "Thermal management of power electronic circuits using thermoelectric coolers and diamond films". United States.
@article{osti_400875,
title = {Thermal management of power electronic circuits using thermoelectric coolers and diamond films},
author = {Vandersande, J W and Ewell, R and Fleurial, J P and Lyon, H B},
abstractNote = {The increased speeds of integrated circuits is accompanied by increased power levels and the need to package the IC chips very close together. Combined, these spell very high power densities and severe thermal problems at the package level. Conventional packaging materials have difficulty dealing with these thermal management problems. However, it is possible to combine both active and passive cooling by using thin film bismuth-telluride thermoelectric coolers (microcoolers) and diamond substrates for the temperature control of these high density electronic circuits. The highest power components would be mounted directly onto thin film thermoelectric elements, which would maintain the temperature of these components from a few degrees to tens of degrees below that of the diamond substrate. This allows these components to operate within their required temperature range, effectively manage temperature spikes and junction temperatures, and increase clockspeed. To optimize the design of the thermoelectric cooler and operate at maximum efficiency, diamond films acting as thermal lenses would also be used to spread the heat from the small power device to the larger coolers. In those instances where the devices are all operating above ambient temperature, high thermal conductivity diamond films alone are sufficient to cool these devices, by effectively conducting the heat throughout the board.},
doi = {},
journal = {},
issn = {0065-8812},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {12}
}

Conference:
Other availability
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