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Title: A novel multilayer circuit process using YBa{sub 2}Cu{sub 3}O{sub {ital x}}/SrTiO{sub 3} thin films patterned by wet etching and ion milling

Abstract

A process combining hydrofluoric acid (HF) and Ar{sup +} ion milling has been used to make YBa{sub 2}Cu{sub 3}O{sub {ital x}}/SrTiO{sub 3}/YBa{sub 2}Cu{sub 3}O{sub {ital x}}(YBCO/STO/YBCO) multilayer test circuits. Low-angle steps can be readily etched in STO and YBCO films with this process. YBCO lines crossing 5{degree} steps have about the same critical temperature {ital T}{sub {ital c}} (89{endash}90 K) and critical current density {ital J}{sub {ital c}} ({approx_gt}1{times}10{sup 6} A/cm{sup 2} at 86 K) as lines on planar surfaces. Via connections have the same {ital T}{sub {ital c}} as other circuit components and adequate critical currents for most circuit designs. {copyright} {ital 1996 American Institute of Physics.}

Authors:
; ; ; ;  [1]
  1. National Institute of Standards and Technology, Boulder, Colorado 80303 (United States)
Publication Date:
Research Org.:
Purdue Univ., West Lafayette, IN (United States)
OSTI Identifier:
388150
DOE Contract Number:  
FG02-90ER45427
Resource Type:
Journal Article
Journal Name:
Applied Physics Letters
Additional Journal Information:
Journal Volume: 69; Journal Issue: 18; Other Information: PBD: Oct 1996
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 66 PHYSICS; HIGH-TC SUPERCONDUCTORS; INTEGRATED CIRCUITS; STRONTIUM OXIDES; THIN FILMS; YTTRIUM OXIDES; BARIUM OXIDES; COPPER OXIDES; STRONTIUM TITANATES; FABRICATION; CRITICAL CURRENT; JOSEPHSON JUNCTIONS; ION BEAMS; ETCHING; MULTILAYERS

Citation Formats

Li, H Q, Ono, R H, Vale, L R, Rudman, D A, and Liou, S H. A novel multilayer circuit process using YBa{sub 2}Cu{sub 3}O{sub {ital x}}/SrTiO{sub 3} thin films patterned by wet etching and ion milling. United States: N. p., 1996. Web. doi:10.1063/1.117700.
Li, H Q, Ono, R H, Vale, L R, Rudman, D A, & Liou, S H. A novel multilayer circuit process using YBa{sub 2}Cu{sub 3}O{sub {ital x}}/SrTiO{sub 3} thin films patterned by wet etching and ion milling. United States. https://doi.org/10.1063/1.117700
Li, H Q, Ono, R H, Vale, L R, Rudman, D A, and Liou, S H. Tue . "A novel multilayer circuit process using YBa{sub 2}Cu{sub 3}O{sub {ital x}}/SrTiO{sub 3} thin films patterned by wet etching and ion milling". United States. https://doi.org/10.1063/1.117700.
@article{osti_388150,
title = {A novel multilayer circuit process using YBa{sub 2}Cu{sub 3}O{sub {ital x}}/SrTiO{sub 3} thin films patterned by wet etching and ion milling},
author = {Li, H Q and Ono, R H and Vale, L R and Rudman, D A and Liou, S H},
abstractNote = {A process combining hydrofluoric acid (HF) and Ar{sup +} ion milling has been used to make YBa{sub 2}Cu{sub 3}O{sub {ital x}}/SrTiO{sub 3}/YBa{sub 2}Cu{sub 3}O{sub {ital x}}(YBCO/STO/YBCO) multilayer test circuits. Low-angle steps can be readily etched in STO and YBCO films with this process. YBCO lines crossing 5{degree} steps have about the same critical temperature {ital T}{sub {ital c}} (89{endash}90 K) and critical current density {ital J}{sub {ital c}} ({approx_gt}1{times}10{sup 6} A/cm{sup 2} at 86 K) as lines on planar surfaces. Via connections have the same {ital T}{sub {ital c}} as other circuit components and adequate critical currents for most circuit designs. {copyright} {ital 1996 American Institute of Physics.}},
doi = {10.1063/1.117700},
url = {https://www.osti.gov/biblio/388150}, journal = {Applied Physics Letters},
number = 18,
volume = 69,
place = {United States},
year = {1996},
month = {10}
}