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Title: Effects of reliability screening tests on bipolar integrated circuits during total dose irradiation

Journal Article · · IEEE Transactions on Nuclear Science
DOI:https://doi.org/10.1109/23.736508· OSTI ID:323941

The effects of burn-in, high temperature reverse bias (HTRB) and life test on the total dose response of three different bipolar ICs are studied. Different behaviors have been observed on one type. Results analyses are consistent with the mechanisms previously reported for MOS devices.

OSTI ID:
323941
Report Number(s):
CONF-980705-; ISSN 0018-9499; TRN: 99:004461
Journal Information:
IEEE Transactions on Nuclear Science, Vol. 45, Issue 6Pt1; Conference: IEEE nuclear and space radiation effects conference, Newport Beach, CA (United States), 20-24 Jul 1998; Other Information: PBD: Dec 1998
Country of Publication:
United States
Language:
English

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