Method and apparatus for the evaluation of a depth profile of thermo-mechanical properties of layered and graded materials and coatings

Patent · Tue Dec 08 00:00:00 EST 1998

OSTI ID:321216

Finot, M; Kesler, O; Suresh, S

A technique for determining properties such as Young`s modulus, coefficient of thermal expansion, and residual stress of individual layers within a multi-layered sample is presented. The technique involves preparation of a series of samples, each including one additional layer relative to the preceding sample. By comparison of each sample to a preceding sample, properties of the topmost layer can be determined, and residual stress at any depth in each sample, resulting from deposition of the top layer, can be determined. 11 figs.

• Research Organization: Idaho National Laboratory (INL), Idaho Falls, ID (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States); Department of the Navy, Washington, DC (United States)
• DOE Contract Number: AC07-94ID13223
• Assignee: Massachusetts Inst. of Tech., Cambridge, MA (United States)
• Patent Number(s): US 5,847,283/A/
• Application Number: PAN: 8-675,121; CNN: Grant N00014-94-1-0139
• OSTI ID: 321216
• Resource Relation: Other Information: PBD: 8 Dec 1998
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES
COMPOSITE MATERIALS
LAYERS
YOUNG MODULUS
THERMAL EXPANSION
RESIDUAL STRESSES
SAMPLE PREPARATION
MEASURING METHODS
MATERIALS TESTING