Load regulating expansion fixture
Patent
·
OSTI ID:321210
A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils is disclosed. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regulating feature, whereby the expansion stresses generated for bonding are regulated and self adjusting. The load regulator comprises a pair of friction isolators with a plurality of annealed copper members located therebetween. The device, with the load regulator, will adjust to and maintain a stress level needed to successfully and economically complete a leak tight bond without damaging thin foils or other delicate components. 1 fig.
- Research Organization:
- Univ. of California (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Univ. of California, Oakland, CA (United States)
- Patent Number(s):
- US 5,848,746/A/
- Application Number:
- PAN: 8-586,129; TRN: 99:003298
- OSTI ID:
- 321210
- Resource Relation:
- Other Information: PBD: 15 Dec 1998
- Country of Publication:
- United States
- Language:
- English
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